Nom de code de l’architecture |
Amber Lake Y |
Coffee Lake |
Date de sortie |
Q1'21 |
27 May 2019 |
Position dans l’évaluation de la performance |
1479 |
1469 |
Processor Number |
6500Y |
E-2276ME |
Série |
Intel Pentium Gold Processor Series |
Intel Xeon E Processor |
Status |
Launched |
Launched |
Segment vertical |
Mobile |
Embedded |
Prix de sortie (MSRP) |
|
$450 |
Soutien de 64-bit |
|
|
Base frequency |
1.10 GHz |
2.80 GHz |
Bus Speed |
4 GT/s |
8 GT/s |
Processus de fabrication |
14 nm |
14 nm |
Température de noyau maximale |
100°C |
100 |
Fréquence maximale |
3.40 GHz |
4.50 GHz |
Cache L1 |
|
384 KB |
Cache L2 |
|
1.5 MB |
Cache L3 |
|
12 MB |
Nombre de noyaux |
|
6 |
Nombre de fils |
|
12 |
Réseaux de mémoire maximale |
2 |
2 |
Bande passante de mémoire maximale |
33.3 GB/s |
|
Taille de mémore maximale |
16 GB |
64 GB |
Genres de mémoire soutenus |
LPDDR3-1866, DDR3L-1600 |
DDR4-2666 |
Device ID |
0x591C |
0x3E94 |
Unités d’éxécution |
23 |
|
Graphics base frequency |
300 MHz |
350 MHz |
Graphics max dynamic frequency |
900 MHz |
1.15 GHz |
Technologie Intel® Clear Video HD |
|
|
Technologie Intel® Clear Video |
|
|
Intel® Quick Sync Video |
|
|
Mémoire de vidéo maximale |
16 GB |
64 GB |
Graphiques du processeur |
Intel UHD Graphics 615 |
Intel UHD Graphics P630 |
Technologie Intel® InTru™ 3D |
|
|
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Nombre d’écrans soutenu |
3 |
3 |
Soutien de la resolution 4K |
|
|
Résolution maximale sur DisplayPort |
3840x2160@60Hz |
4096x2304@30Hz |
Résolution maximale sur eDP |
3840x2160@60Hz |
4096x2304@30Hz |
DirectX |
12 |
12 |
OpenGL |
4.5 |
4.5 |
Configurable TDP-down |
3.5 Watt |
35 Watt |
Configurable TDP-down Frequency |
600 MHz |
|
Configurable TDP-up |
7 Watt |
|
Configurable TDP-up Frequency |
1.60 GHz |
|
Nombre de CPUs maximale dans une configuration |
1 |
1 |
Package Size |
20mm X 16.5mm |
42mm x 28mm |
Thermal Design Power (TDP) |
5 Watt |
45 Watt |
Prise courants soutenu |
|
FCBGA1440 |
Nombre maximale des voies PCIe |
10 |
16 |
Révision PCI Express |
3.0 |
3.0 |
PCIe configurations |
1x4, 2x2, 1x2+2x1 and 4x1 |
Up to 1x16, 2x8, 1x8+2x4 |
Execute Disable Bit (EDB) |
|
|
Technologie Intel® Identity Protection |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Technologie Intel® Secure Key |
|
|
Technologie Intel® Trusted Execution (TXT) |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Secure Boot |
|
|
Technologie Enhanced Intel SpeedStep® |
|
|
Idle States |
|
|
Extensions de l’ensemble d’instructions |
Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
Intel SSE4.1, Intel SSE4.2, Intel AVX2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Intel® Flex Memory Access |
|
|
Technologie Intel® Hyper-Threading |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Technologie Intel® Turbo Boost |
|
|
Speed Shift technology |
|
|
Thermal Monitoring |
|
|
Technologie Intel® My WiFi |
|
|
Intel® Optane™ Memory Supported |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|