| Architektur Codename |
Elkhart Lake |
Arrandale |
| Startdatum |
Q1'21 |
4 December 2010 |
| Einführungspreis (MSRP) |
$55 |
$39 |
| Platz in der Leistungsbewertung |
2624 |
2614 |
| Processor Number |
6414RE |
i3-390M |
| Serie |
Intel Atom Processor X Series |
Legacy Intel® Core™ Processors |
| Vertikales Segment |
Embedded |
Mobile |
| Jetzt kaufen |
|
$38.95 |
| Status |
|
Discontinued |
| Preis-Leistungs-Verhältnis (0-100) |
|
16.49 |
| 64-Bit-Unterstützung |
|
|
| Base frequency |
1.50 GHz |
2.66 GHz |
| L2 Cache |
1.5 MB |
512 KB |
| Fertigungsprozesstechnik |
10 nm |
32 nm |
| Maximale Kerntemperatur |
110°C |
90°C for rPGA, 105°C for BGA |
| Anzahl der Adern |
4 |
2 |
| Anzahl der Gewinde |
4 |
4 |
| Operating Temperature Range |
-40°C to 85°C |
|
| Bus Speed |
|
2.5 GT/s DMI |
| Matrizengröße |
|
81 mm2 |
| Frontseitiger Bus (FSB) |
|
2500 MHz |
| L1 Cache |
|
64 KB (per core) |
| L3 Cache |
|
3072 KB |
| Maximale Frequenz |
|
2.66 GHz |
| Anzahl der Transistoren |
|
382 million |
| Maximale Speicherkanäle |
4 |
2 |
| Maximale Speicherbandbreite |
51.2 GB/s |
17.1 GB/s |
| Maximale Speichergröße |
32 GB |
8 GB |
| Unterstützte Speichertypen |
4x32 LPDDR4/x 3200MT/s Max 16GB / 2x64 DDR4 3200MT/s Max 32GB, LPDDR4/x & DDR4 with In Band ECC, |
DDR3 800/1066 |
| Ausführungseinheiten |
16 |
|
| Graphics base frequency |
400 MHz |
500 MHz |
| Intel® Quick Sync Video |
|
|
| Prozessorgrafiken |
Intel UHD Graphics for 10th Gen Intel Processors |
Intel HD Graphics |
| Graphics max dynamic frequency |
|
667 MHz |
| Grafik Maximalfrequenz |
|
667 MHz |
| Intel® Clear Video HD Technologie |
|
|
| Intel® Clear Video Technologie |
|
|
| Intel® Flexible Display Interface (Intel® FDI) |
|
|
| DisplayPort |
|
|
| eDP |
|
|
| HDMI |
|
|
| MIPI-DSI |
|
|
| Anzahl der unterstützten Anzeigen |
3 |
2 |
| Unterstützung von 4K-Auflösungen |
|
|
| Maximale Auflösung über DisplayPort |
4096x2160@ 60Hz |
|
| Maximale Auflösung über eDP |
4096x2160@ 60Hz |
|
| DirectX |
Yes |
|
| OpenGL |
Yes |
|
| Maximale Anzahl von CPUs in einer Konfiguration |
1 |
1 |
| Package Size |
35mm x 24mm |
rPGA 37.5mmx 37.5mm, BGA 34mmx28mm |
| Unterstützte Sockel |
FCBGA1493 |
BGA1288, PGA988 |
| Thermische Designleistung (TDP) |
9 Watt |
35 Watt |
| Low Halogen Options Available |
|
|
| Integriertes LAN |
|
|
| Maximale Anzahl von PCIe-Strecken |
8 |
16 |
| Anzahl der USB-Ports |
4 |
|
| PCI Express Revision |
3.0 |
2.0 |
| PCIe configurations |
PCIe 0: 1 x4/2 x2/1 x2 + 2 x1/4 x1, PCIe 1-3: 1 x2/1 x1 |
1x16 |
| Gesamtzahl der SATA-Anschlüsse |
2 |
|
| UART |
|
|
| USB-Überarbeitung |
2.0/3.0/3.1 |
|
| Execute Disable Bit (EDB) |
|
|
| Intel® OS Guard |
|
|
| Intel® Secure Key Technologie |
|
|
| Intel® Trusted Execution Technologie (TXT) |
|
|
| Secure Boot |
|
|
| General-Purpose Input/Output (GPIO) |
|
|
| HD Audio |
|
|
| Idle States |
|
|
| Intel 64 |
|
|
| Intel® AES New Instructions |
|
|
| Intel® Hyper-Threading Technologie |
|
|
| Speed Shift technology |
|
|
| Enhanced Intel SpeedStep® Technologie |
|
|
| Flexible Display interface (FDI) |
|
|
| Befehlssatzerweiterungen |
|
Intel® SSE4.1, Intel® SSE4.2 |
| Intel® Fast Memory Access |
|
|
| Intel® Flex Memory Access |
|
|
| Intel® Turbo Boost Technologie |
|
|
| Intel® vPro™ Platform Eligibility |
|
|
| Physical Address Extensions (PAE) |
|
36-bit |
| Thermal Monitoring |
|
|
| Intel® Virtualization Technology (VT-x) |
|
|
| Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
| Intel® VT-x with Extended Page Tables (EPT) |
|
|