| Nombre clave de la arquitectura |
Elkhart Lake |
Arrandale |
| Fecha de lanzamiento |
Q1'21 |
4 December 2010 |
| Precio de lanzamiento (MSRP) |
$55 |
$39 |
| Lugar en calificación por desempeño |
2624 |
2614 |
| Processor Number |
6414RE |
i3-390M |
| Series |
Intel Atom Processor X Series |
Legacy Intel® Core™ Processors |
| Segmento vertical |
Embedded |
Mobile |
| Precio ahora |
|
$38.95 |
| Status |
|
Discontinued |
| Valor/costo (0-100) |
|
16.49 |
| Soporte de 64 bits |
|
|
| Base frequency |
1.50 GHz |
2.66 GHz |
| Caché L2 |
1.5 MB |
512 KB |
| Tecnología de proceso de manufactura |
10 nm |
32 nm |
| Temperatura máxima del núcleo |
110°C |
90°C for rPGA, 105°C for BGA |
| Número de núcleos |
4 |
2 |
| Número de subprocesos |
4 |
4 |
| Operating Temperature Range |
-40°C to 85°C |
|
| Bus Speed |
|
2.5 GT/s DMI |
| Troquel |
|
81 mm2 |
| Bus frontal (FSB) |
|
2500 MHz |
| Caché L1 |
|
64 KB (per core) |
| Caché L3 |
|
3072 KB |
| Frecuencia máxima |
|
2.66 GHz |
| Número de transistores |
|
382 million |
| Canales máximos de memoria |
4 |
2 |
| Máximo banda ancha de la memoria |
51.2 GB/s |
17.1 GB/s |
| Tamaño máximo de la memoria |
32 GB |
8 GB |
| Tipos de memorias soportadas |
4x32 LPDDR4/x 3200MT/s Max 16GB / 2x64 DDR4 3200MT/s Max 32GB, LPDDR4/x & DDR4 with In Band ECC, |
DDR3 800/1066 |
| Unidades de ejecución |
16 |
|
| Graphics base frequency |
400 MHz |
500 MHz |
| Intel® Quick Sync Video |
|
|
| Procesador gráfico |
Intel UHD Graphics for 10th Gen Intel Processors |
Intel HD Graphics |
| Graphics max dynamic frequency |
|
667 MHz |
| Frecuencia gráfica máxima |
|
667 MHz |
| Tecnología Intel® Clear Video HD |
|
|
| Tecnología Intel® Clear Video |
|
|
| Intel® Flexible Display Interface (Intel® FDI) |
|
|
| DisplayPort |
|
|
| eDP |
|
|
| HDMI |
|
|
| MIPI-DSI |
|
|
| Número de pantallas soportadas |
3 |
2 |
| Soporte de resolución 4K |
|
|
| Máxima resolución por DisplayPort |
4096x2160@ 60Hz |
|
| Máxima resolución por eDP |
4096x2160@ 60Hz |
|
| DirectX |
Yes |
|
| OpenGL |
Yes |
|
| Número máximo de CPUs en la configuración |
1 |
1 |
| Package Size |
35mm x 24mm |
rPGA 37.5mmx 37.5mm, BGA 34mmx28mm |
| Zócalos soportados |
FCBGA1493 |
BGA1288, PGA988 |
| Diseño energético térmico (TDP) |
9 Watt |
35 Watt |
| Low Halogen Options Available |
|
|
| LAN integrado |
|
|
| Número máximo de canales PCIe |
8 |
16 |
| Número de puertos USB |
4 |
|
| Clasificación PCI Express |
3.0 |
2.0 |
| PCIe configurations |
PCIe 0: 1 x4/2 x2/1 x2 + 2 x1/4 x1, PCIe 1-3: 1 x2/1 x1 |
1x16 |
| Número total de puertos SATA |
2 |
|
| UART |
|
|
| Clasificación USB |
2.0/3.0/3.1 |
|
| Execute Disable Bit (EDB) |
|
|
| Intel® OS Guard |
|
|
| Tecnología Intel® Secure Key |
|
|
| Tecnología Intel® Trusted Execution (TXT) |
|
|
| Secure Boot |
|
|
| General-Purpose Input/Output (GPIO) |
|
|
| HD Audio |
|
|
| Idle States |
|
|
| Intel 64 |
|
|
| Intel® AES New Instructions |
|
|
| Tecnología Intel® Hyper-Threading |
|
|
| Speed Shift technology |
|
|
| Tecnología Enhanced Intel SpeedStep® |
|
|
| Flexible Display interface (FDI) |
|
|
| Instruction set extensions |
|
Intel® SSE4.1, Intel® SSE4.2 |
| Intel® Fast Memory Access |
|
|
| Intel® Flex Memory Access |
|
|
| Tecnología Intel® Turbo Boost |
|
|
| Intel® vPro™ Platform Eligibility |
|
|
| Physical Address Extensions (PAE) |
|
36-bit |
| Thermal Monitoring |
|
|
| Intel® Virtualization Technology (VT-x) |
|
|
| Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
| Intel® VT-x with Extended Page Tables (EPT) |
|
|