Architektur Codename |
Cascade Lake |
Haswell |
Startdatum |
2 Apr 2019 |
Q2'14 |
Einführungspreis (MSRP) |
$1221 |
|
Platz in der Leistungsbewertung |
816 |
920 |
Processor Number |
5222 |
E3-1286V3 |
Serie |
2nd Generation Intel Xeon Scalable Processors |
Intel® Xeon® Processor E3 v3 Family |
Status |
Launched |
Discontinued |
Vertikales Segment |
Server |
Server |
Base frequency |
3.80 GHz |
3.70 GHz |
L1 Cache |
256 KB |
|
L2 Cache |
4 MB |
|
L3 Cache |
16.5 MB |
|
Fertigungsprozesstechnik |
14 nm |
22 nm |
Maximale Kerntemperatur |
72°C |
|
Maximale Frequenz |
3.90 GHz |
4.10 GHz |
Anzahl der Adern |
4 |
4 |
Anzahl der Gewinde |
8 |
8 |
Number of Ultra Path Interconnect (UPI) Links |
2 |
|
64-Bit-Unterstützung |
|
|
Bus Speed |
|
5 GT/s DMI2 |
Number of QPI Links |
|
0 |
ECC-Speicherunterstützung |
|
|
Maximale Speicherkanäle |
6 |
2 |
Maximale Speicherbandbreite |
131.13 GB/s |
25.6 GB/s |
Maximale Speichergröße |
1 TB |
32 GB |
Supported memory frequency |
2933 MHz |
|
Unterstützte Speichertypen |
DDR4-2933 |
DDR3 and DDR3L 1333/1600 at 1.5V |
Package Size |
76.0mm x 56.5mm |
37.5mm x 37.5mm |
Unterstützte Sockel |
FCLGA3647 |
FCLGA1150 |
Thermische Designleistung (TDP) |
105 Watt |
84 Watt |
Low Halogen Options Available |
|
|
Maximale Anzahl von CPUs in einer Konfiguration |
|
1 |
Thermal Solution |
|
PCG 2013D |
Maximale Anzahl von PCIe-Strecken |
48 |
16 |
PCI Express Revision |
3.0 |
3.0 |
Scalability |
4S |
1S Only |
PCIe configurations |
|
1x16, 2x8, 1x8/2x4 |
Execute Disable Bit (EDB) |
|
|
Intel® Run Sure Technology |
|
|
Intel® Trusted Execution Technologie (TXT) |
|
|
Mode-based Execute Control (MBE) |
|
|
Anti-Theft Technologie |
|
|
Intel® Identity Protection Technologie |
|
|
Intel® OS Guard |
|
|
Intel® Secure Key Technologie |
|
|
Enhanced Intel SpeedStep® Technologie |
|
|
Befehlssatzerweiterungen |
Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 |
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Intel® Hyper-Threading Technologie |
|
|
Intel® Turbo Boost Technologie |
|
|
Intel® Volume Management Device (VMD) |
|
|
Number of AVX-512 FMA Units |
2 |
|
Speed Shift technology |
|
|
Idle States |
|
|
Intel® Fast Memory Access |
|
|
Intel® Flex Memory Access |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® TSX-NI |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Thermal Monitoring |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
Ausführungseinheiten |
|
20 |
Graphics base frequency |
|
350 MHz |
Graphics max dynamic frequency |
|
1.30 GHz |
Intel® Clear Video HD Technologie |
|
|
Intel® Flexible Display Interface (Intel® FDI) |
|
|
Intel® InTru™ 3D-Technologie |
|
|
Intel® Quick Sync Video |
|
|
Maximaler Videospeicher |
|
1.7 GB |
DisplayPort |
|
|
eDP |
|
|
HDMI |
|
|
Anzahl der unterstützten Anzeigen |
|
3 |
VGA |
|
|
Maximale Auflösung über DisplayPort |
|
3840x2160@60Hz |
Maximale Auflösung über HDMI 1.4 |
|
3840x2160@60Hz |
Maximale Auflösung über VGA |
|
2880x1800@60Hz |
DirectX |
|
11.2 |
OpenGL |
|
4.3 |