Intel Atom E660 processor review
Atom E660 processor released by Intel; release date: September 2010. At the time of release, the processor cost $54. The processor is designed for embedded-computers and based on Tunnel Creek microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 1, threads - 2. Maximum CPU clock speed - 1.3 GHz. Maximum operating temperature - 90°C. Manufacturing process technology - 45 nm. Cache size: L1 - 64 KB (per core), L2 - 512 KB (per core).
Supported memory types: DDR2 800. Maximum memory size: 2 GB.
Supported socket types: FCBGA676. Maximum number of processors in a configuration - 1. Power consumption (TDP): 3.6 Watt.
The processor has integrated graphics Integrated.
Benchmarks
| PassMark Single thread mark |
|
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| PassMark CPU mark |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 0 |
| PassMark - CPU mark | 271 |
Specifications (specs)
Essentials |
|
| Architecture codename | Tunnel Creek |
| Launch date | September 2010 |
| Launch price (MSRP) | $54 |
| Place in performance rating | 3334 |
| Price now | $54 |
| Processor Number | E660 |
| Series | Legacy Intel Atom® Processors |
| Status | Launched |
| Value for money (0-100) | 1.48 |
| Vertical segment | Embedded |
Performance |
|
| Base frequency | 1.30 GHz |
| Bus Speed | 2500 MHz PCIE |
| Die size | 26 mm |
| L1 cache | 64 KB (per core) |
| L2 cache | 512 KB (per core) |
| Manufacturing process technology | 45 nm |
| Maximum core temperature | 90°C |
| Maximum frequency | 1.3 GHz |
| Number of cores | 1 |
| Number of threads | 2 |
| Transistor count | 47 million |
| VID voltage range | VCC (0.75 - 0.9V), VNN (0.75 - 1.1V) |
Memory |
|
| Max memory channels | 1 |
| Maximum memory size | 2 GB |
| Supported memory types | DDR2 800 |
Graphics |
|
| Graphics base frequency | 400 MHz |
| Processor graphics | Integrated |
Compatibility |
|
| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 1 |
| Package Size | 22mmx22mm |
| Sockets supported | FCBGA676 |
| Thermal Design Power (TDP) | 3.6 Watt |
Peripherals |
|
| Max number of PCIe lanes | 4 |
| PCI Express revision | 1.0a |
| PCIe configurations | x1, root complex only |
Security & Reliability |
|
| Execute Disable Bit (EDB) | |
| Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
|
| Enhanced Intel SpeedStep® technology | |
| FSB parity | |
| Idle States | |
| Intel 64 | |
| Intel® Demand Based Switching | |
| Intel® Hyper-Threading technology | |
| Intel® Turbo Boost technology | |
| Thermal Monitoring | |
Virtualization |
|
| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
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