Intel Celeron 857 processor review

Intel Celeron 857

Celeron 857 processor released by Intel; release date: July 2011. The processor is designed for mobile-computers and based on Sandy Bridge microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 1.2 GHz. Maximum operating temperature - 100 °C. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 2048 KB (shared).

Supported memory types: DDR3 1066/1333. Maximum memory size: 16 GB.

Supported socket types: Intel BGA1023. Maximum number of processors in a configuration - 1. Power consumption (TDP): 17 Watt.

The processor has integrated graphics Intel HD Graphics with the following parameters: maximum frequency - 1 GHz.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
4870
476
PassMark
CPU mark
Top 1 CPU
This CPU
156834
569
Name Value
PassMark - Single thread mark 476
PassMark - CPU mark 569

Specifications (specs)

Essentials

Architecture codename Sandy Bridge
Launch date July 2011
Place in performance rating 3020
Processor Number 857
Series Legacy Intel® Celeron® Processor
Status Launched
Vertical segment Mobile

Performance

64 bit support
Base frequency 1.20 GHz
Bus Speed 5 GT/s DMI
Die size 131 mm
L1 cache 64 KB (per core)
L2 cache 256 KB (per core)
L3 cache 2048 KB (shared)
Manufacturing process technology 32 nm
Maximum core temperature 100 °C
Maximum frequency 1.2 GHz
Number of cores 2
Number of threads 2
Transistor count 504 million

Memory

Max memory channels 2
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 16 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.00 GHz
Graphics max frequency 1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 31.0mm x 24.0mm (BGA1023)
Sockets supported Intel BGA1023
Thermal Design Power (TDP) 17 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

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