Intel Core 2 Duo E8500 processor review
Core 2 Duo E8500 processor released by Intel; release date: August 2008. The processor is designed for desktop-computers and based on Wolfdale microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2. Maximum CPU clock speed - 3.33 GHz. Maximum operating temperature - 72.4°C. Manufacturing process technology - 45 nm. Cache size: L1 - 64 KB, L2 - 6144 KB.
Supported memory types: DDR1, DDR2, DDR3.
Supported socket types: LGA775. Maximum number of processors in a configuration - 1. Power consumption (TDP): 65 Watt.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Geekbench 4 Single Core |
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| Geekbench 4 Multi-Core |
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| CompuBench 1.5 Desktop Face Detection |
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| CompuBench 1.5 Desktop Ocean Surface Simulation |
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| CompuBench 1.5 Desktop T-Rex |
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| CompuBench 1.5 Desktop Bitcoin Mining |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 1322 |
| PassMark - CPU mark | 1276 |
| Geekbench 4 - Single Core | 439 |
| Geekbench 4 - Multi-Core | 754 |
| CompuBench 1.5 Desktop - Face Detection | 0.344 mPixels/s |
| CompuBench 1.5 Desktop - Ocean Surface Simulation | 23.046 Frames/s |
| CompuBench 1.5 Desktop - T-Rex | 0.086 Frames/s |
| CompuBench 1.5 Desktop - Bitcoin Mining | 2.496 mHash/s |
Specifications (specs)
Essentials |
|
| Architecture codename | Wolfdale |
| Launch date | August 2008 |
| Place in performance rating | 2937 |
| Price now | $39.99 |
| Processor Number | E8500 |
| Series | Legacy Intel® Core™ Processors |
| Status | Discontinued |
| Value for money (0-100) | 16.84 |
| Vertical segment | Desktop |
Performance |
|
| 64 bit support | |
| Base frequency | 3.16 GHz |
| Bus Speed | 1333 MHz FSB |
| Die size | 107 mm2 |
| L1 cache | 64 KB |
| L2 cache | 6144 KB |
| Manufacturing process technology | 45 nm |
| Maximum case temperature (TCase) | 72 °C |
| Maximum core temperature | 72.4°C |
| Maximum frequency | 3.33 GHz |
| Number of cores | 2 |
| Transistor count | 410 million |
| VID voltage range | 0.8500V-1.3625V |
Memory |
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| Supported memory types | DDR1, DDR2, DDR3 |
Compatibility |
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| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 1 |
| Package Size | 37.5mm x 37.5mm |
| Sockets supported | LGA775 |
| Thermal Design Power (TDP) | 65 Watt |
Security & Reliability |
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| Execute Disable Bit (EDB) | |
| Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | |
| FSB parity | |
| Idle States | |
| Intel 64 | |
| Intel® AES New Instructions | |
| Intel® Demand Based Switching | |
| Intel® Hyper-Threading technology | |
| Intel® Turbo Boost technology | |
| Thermal Monitoring | |
Virtualization |
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| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
Navigation
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