Intel Core 2 Duo P7570 processor review
Core 2 Duo P7570 processor released by Intel; release date: 1 October 2009. The processor is designed for mobile-computers and based on Penryn microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum CPU clock speed - 2.26 GHz. Maximum operating temperature - 105°C. Manufacturing process technology - 45 nm. Cache size: L2 - 3072 KB.
Supported socket types: PGA478. Power consumption (TDP): 25 Watt.
Benchmarks
PassMark Single thread mark |
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PassMark CPU mark |
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Geekbench 4 Single Core |
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Geekbench 4 Multi-Core |
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Name | Value |
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PassMark - Single thread mark | 930 |
PassMark - CPU mark | 845 |
Geekbench 4 - Single Core | 1475 |
Geekbench 4 - Multi-Core | 2381 |
Specifications (specs)
Essentials |
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Architecture codename | Penryn |
Launch date | 1 October 2009 |
Place in performance rating | 1986 |
Processor Number | P7570 |
Series | Legacy Intel® Core™ Processors |
Status | Discontinued |
Vertical segment | Mobile |
Performance |
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64 bit support | |
Base frequency | 2.26 GHz |
Bus Speed | 1066 MHz FSB |
Die size | 107 mm2 |
Front-side bus (FSB) | 1066 MHz |
L2 cache | 3072 KB |
Manufacturing process technology | 45 nm |
Maximum core temperature | 105°C |
Maximum frequency | 2.26 GHz |
Number of cores | 2 |
Number of threads | 2 |
Transistor count | 410 million |
Compatibility |
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Low Halogen Options Available | |
Sockets supported | PGA478 |
Thermal Design Power (TDP) | 25 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
FSB parity | |
Idle States | |
Intel 64 | |
Intel® Hyper-Threading technology | |
Intel® Turbo Boost technology | |
Thermal Monitoring | |
Virtualization |
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Intel® Virtualization Technology (VT-x) |