Intel Core i3-6100U vs Intel Core 2 Duo P7570
Comparative analysis of Intel Core i3-6100U and Intel Core 2 Duo P7570 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-6100U
- CPU is newer: launch date 5 year(s) 11 month(s) later
- 2 more threads: 4 vs 2
- Around 2% higher clock speed: 2.3 GHz vs 2.26 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- Around 67% lower typical power consumption: 15 Watt vs 25 Watt
- Around 43% better performance in PassMark - Single thread mark: 1332 vs 930
- 3.1x better performance in PassMark - CPU mark: 2631 vs 845
| Specifications (specs) | |
| Launch date | 1 September 2015 vs 1 October 2009 |
| Number of threads | 4 vs 2 |
| Maximum frequency | 2.3 GHz vs 2.26 GHz |
| Manufacturing process technology | 14 nm vs 45 nm |
| Thermal Design Power (TDP) | 15 Watt vs 25 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 1332 vs 930 |
| PassMark - CPU mark | 2631 vs 845 |
Reasons to consider the Intel Core 2 Duo P7570
- Around 5% higher maximum core temperature: 105°C vs 100°C
- 6x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.6x better performance in Geekbench 4 - Single Core: 1475 vs 561
- Around 85% better performance in Geekbench 4 - Multi-Core: 2381 vs 1290
| Specifications (specs) | |
| Maximum core temperature | 105°C vs 100°C |
| L2 cache | 3072 KB vs 512 KB |
| Benchmarks | |
| Geekbench 4 - Single Core | 1475 vs 561 |
| Geekbench 4 - Multi-Core | 2381 vs 1290 |
Compare benchmarks
CPU 1: Intel Core i3-6100U
CPU 2: Intel Core 2 Duo P7570
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Core i3-6100U | Intel Core 2 Duo P7570 |
|---|---|---|
| PassMark - Single thread mark | 1332 | 930 |
| PassMark - CPU mark | 2631 | 845 |
| Geekbench 4 - Single Core | 561 | 1475 |
| Geekbench 4 - Multi-Core | 1290 | 2381 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.829 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 35.603 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.222 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.873 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 2.097 | |
| GFXBench 4.0 - Car Chase Offscreen (Frames) | 1259 | |
| GFXBench 4.0 - Manhattan (Frames) | 2258 | |
| GFXBench 4.0 - T-Rex (Frames) | 3360 | |
| GFXBench 4.0 - Car Chase Offscreen (Fps) | 1259 | |
| GFXBench 4.0 - Manhattan (Fps) | 2258 | |
| GFXBench 4.0 - T-Rex (Fps) | 3360 |
Compare specifications (specs)
| Intel Core i3-6100U | Intel Core 2 Duo P7570 | |
|---|---|---|
Essentials |
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| Architecture codename | Skylake | Penryn |
| Launch date | 1 September 2015 | 1 October 2009 |
| Launch price (MSRP) | $281 | |
| Place in performance rating | 1990 | 1986 |
| Price now | $515 | |
| Processor Number | i3-6100U | P7570 |
| Series | 6th Generation Intel® Core™ i3 Processors | Legacy Intel® Core™ Processors |
| Status | Launched | Discontinued |
| Value for money (0-100) | 2.06 | |
| Vertical segment | Mobile | Mobile |
Performance |
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| 64 bit support | ||
| Base frequency | 2.30 GHz | 2.26 GHz |
| Bus Speed | 4 GT/s OPI | 1066 MHz FSB |
| Die size | 99 mm | 107 mm2 |
| L1 cache | 128 KB | |
| L2 cache | 512 KB | 3072 KB |
| L3 cache | 3 MB | |
| Manufacturing process technology | 14 nm | 45 nm |
| Maximum core temperature | 100°C | 105°C |
| Maximum frequency | 2.3 GHz | 2.26 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 2 |
| Front-side bus (FSB) | 1066 MHz | |
| Transistor count | 410 million | |
Memory |
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| Max memory channels | 2 | |
| Maximum memory bandwidth | 34.1 GB/s | |
| Maximum memory size | 32 GB | |
| Supported memory types | DDR4-2133, LPDDR3-1866, DDR3L-1600 | |
Graphics |
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| Device ID | 0x1916 | |
| Graphics base frequency | 300 MHz | |
| Graphics max dynamic frequency | 1.00 GHz | |
| Graphics max frequency | 1 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 32 GB | |
| Processor graphics | Intel® HD Graphics 520 | |
Graphics interfaces |
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| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
| Wireless Display (WiDi) support | ||
Graphics image quality |
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| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2304@60Hz | |
| Max resolution over eDP | 4096x2304@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
| Max resolution over WiDi | 1080p | |
Graphics API support |
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| DirectX | 12 | |
| OpenGL | 4.5 | |
Compatibility |
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| Configurable TDP-down | 7.5 W | |
| Configurable TDP-down Frequency | 800 MHz | |
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 42mm X 24mm | |
| Sockets supported | FCBGA1356 | PGA478 |
| Thermal Design Power (TDP) | 15 Watt | 25 Watt |
Peripherals |
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| Max number of PCIe lanes | 12 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | 1x4, 2x2, 1x2+2x1 and 4x1 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Smart Response technology | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| FSB parity | ||
Virtualization |
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| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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