AMD R-272F vs Intel Core 2 Duo P7570
Comparative analysis of AMD R-272F and Intel Core 2 Duo P7570 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD R-272F
- CPU is newer: launch date 2 year(s) 7 month(s) later
- Around 42% higher clock speed: 3.2 GHz vs 2.26 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- Around 17% better performance in PassMark - Single thread mark: 1087 vs 930
- Around 44% better performance in PassMark - CPU mark: 1215 vs 845
Specifications (specs) | |
Launch date | 21 May 2012 vs 1 October 2009 |
Maximum frequency | 3.2 GHz vs 2.26 GHz |
Manufacturing process technology | 32 nm vs 45 nm |
Benchmarks | |
PassMark - Single thread mark | 1087 vs 930 |
PassMark - CPU mark | 1215 vs 845 |
Reasons to consider the Intel Core 2 Duo P7570
- Around 5% higher maximum core temperature: 105°C vs 100 °C
- 3x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 40% lower typical power consumption: 25 Watt vs 35 Watt
Maximum core temperature | 105°C vs 100 °C |
L2 cache | 3072 KB vs 1 MB |
Thermal Design Power (TDP) | 25 Watt vs 35 Watt |
Compare benchmarks
CPU 1: AMD R-272F
CPU 2: Intel Core 2 Duo P7570
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD R-272F | Intel Core 2 Duo P7570 |
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PassMark - Single thread mark | 1087 | 930 |
PassMark - CPU mark | 1215 | 845 |
Geekbench 4 - Single Core | 1475 | |
Geekbench 4 - Multi-Core | 2381 |
Compare specifications (specs)
AMD R-272F | Intel Core 2 Duo P7570 | |
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Essentials |
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Architecture codename | Piledriver | Penryn |
Launch date | 21 May 2012 | 1 October 2009 |
Place in performance rating | 2189 | 1986 |
Vertical segment | Embedded | Mobile |
Processor Number | P7570 | |
Series | Legacy Intel® Core™ Processors | |
Status | Discontinued | |
Performance |
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64 bit support | ||
Base frequency | 2.7 GHz | 2.26 GHz |
L1 cache | 96 KB | |
L2 cache | 1 MB | 3072 KB |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 100 °C | 105°C |
Maximum frequency | 3.2 GHz | 2.26 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Bus Speed | 1066 MHz FSB | |
Die size | 107 mm2 | |
Front-side bus (FSB) | 1066 MHz | |
Transistor count | 410 million | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Supported memory types | DDR3-1600, DDR3L-1600, DDR3U-1600 | |
Graphics |
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Graphics base frequency | 497 MHz | |
Graphics max frequency | 686 MHz | |
Number of pipelines | 192 | |
Processor graphics | Radeon HD 7520G | |
Unified Video Decoder (UVD) | ||
Video Codec Engine (VCE) | ||
Graphics interfaces |
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DisplayPort | ||
DVI | ||
HDMI | ||
Number of displays supported | 4 | |
VGA | ||
Graphics API support |
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DirectX | 11 | |
OpenGL | 4.2 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | |
Sockets supported | FS1 | PGA478 |
Thermal Design Power (TDP) | 35 Watt | 25 Watt |
Low Halogen Options Available | ||
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
Advanced Technologies |
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Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Fused Multiply-Add 4 (FMA4) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) |