Intel Core 2 Duo E6700 vs Intel Core i7-870
Comparative analysis of Intel Core 2 Duo E6700 and Intel Core i7-870 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core 2 Duo E6700
- Around 46% lower typical power consumption: 65 Watt vs 95 Watt
Thermal Design Power (TDP) | 65 Watt vs 95 Watt |
Reasons to consider the Intel Core i7-870
- 2 more cores, run more applications at once: 4 vs 2
- Around 21% higher maximum core temperature: 72.7°C vs 60.1°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- Around 35% better performance in PassMark - Single thread mark: 1384 vs 1023
- 3.2x better performance in PassMark - CPU mark: 3140 vs 990
- Around 73% better performance in Geekbench 4 - Single Core: 547 vs 317
- 3.6x better performance in Geekbench 4 - Multi-Core: 2032 vs 564
Specifications (specs) | |
Number of cores | 4 vs 2 |
Maximum core temperature | 72.7°C vs 60.1°C |
Manufacturing process technology | 45 nm vs 65 nm |
Benchmarks | |
PassMark - Single thread mark | 1384 vs 1023 |
PassMark - CPU mark | 3140 vs 990 |
Geekbench 4 - Single Core | 547 vs 317 |
Geekbench 4 - Multi-Core | 2032 vs 564 |
Compare benchmarks
CPU 1: Intel Core 2 Duo E6700
CPU 2: Intel Core i7-870
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core 2 Duo E6700 | Intel Core i7-870 |
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PassMark - Single thread mark | 1023 | 1384 |
PassMark - CPU mark | 990 | 3140 |
Geekbench 4 - Single Core | 317 | 547 |
Geekbench 4 - Multi-Core | 564 | 2032 |
3DMark Fire Strike - Physics Score | 2453 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.029 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 53.478 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.342 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.541 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 4.602 |
Compare specifications (specs)
Intel Core 2 Duo E6700 | Intel Core i7-870 | |
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Essentials |
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Architecture codename | Conroe | Lynnfield |
Launch date | Q3'06 | September 2009 |
Place in performance rating | 2701 | 2671 |
Processor Number | E6700 | i7-870 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Desktop |
Launch price (MSRP) | $197 | |
Price now | $98.99 | |
Value for money (0-100) | 15.90 | |
Performance |
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64 bit support | ||
Base frequency | 2.66 GHz | 2.93 GHz |
Bus Speed | 1066 MHz FSB | 2.5 GT/s DMI |
Die size | 143 mm2 | 296 mm2 |
Manufacturing process technology | 65 nm | 45 nm |
Maximum core temperature | 60.1°C | 72.7°C |
Number of cores | 2 | 4 |
Transistor count | 291 million | 774 million |
VID voltage range | 0.8500V-1.5V | 0.6500V-1.4000V |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 8192 KB (shared) | |
Maximum frequency | 3.60 GHz | |
Number of threads | 8 | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Scenario Design Power (SDP) | 0 W | |
Sockets supported | PLGA775 | LGA1156 |
Thermal Design Power (TDP) | 65 Watt | 95 Watt |
Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Instruction set extensions | Intel® SSE4.2 | |
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 21 GB/s | |
Maximum memory size | 16 GB | |
Supported memory types | DDR3 1066/1333 | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8 |