Intel Pentium G3460T processor review
Pentium G3460T processor released by Intel; release date: Q1'15. The processor is designed for desktop-computers and based on Haswell microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 2, threads - 2. Maximum operating temperature - 66.4°C. Manufacturing process technology - 22 nm.
Supported memory types: DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V. Maximum memory size: 32 GB.
Supported socket types: FCLGA1150. Maximum number of processors in a configuration - 1. Power consumption (TDP): 35 Watt.
The processor has integrated graphics Intel HD Graphics with the following parameters: maximum video memory size - 1.7 GB.
Specifications (specs)
Essentials |
|
Architecture codename | Haswell |
Launch date | Q1'15 |
Place in performance rating | not rated |
Processor Number | G3460T |
Series | Intel® Pentium® Processor G Series |
Status | Discontinued |
Vertical segment | Desktop |
Performance |
|
64 bit support | |
Base frequency | 3.00 GHz |
Bus Speed | 5 GT/s DMI2 |
Manufacturing process technology | 22 nm |
Maximum core temperature | 66.4°C |
Number of cores | 2 |
Number of threads | 2 |
Memory |
|
Max memory channels | 2 |
Maximum memory bandwidth | 25.6 GB/s |
Maximum memory size | 32 GB |
Supported memory types | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V |
Graphics |
|
Graphics base frequency | 200 MHz |
Graphics max dynamic frequency | 1.10 GHz |
Intel® Quick Sync Video | |
Max video memory | 1.7 GB |
Processor graphics | Intel HD Graphics |
Graphics interfaces |
|
DisplayPort | |
DVI | |
eDP | |
HDMI | |
Number of displays supported | 3 |
VGA | |
Graphics image quality |
|
Max resolution over DisplayPort | 2560x1600@60Hz |
Max resolution over eDP | 2560x1600@60Hz |
Max resolution over HDMI 1.4 | 1920x1080@60Hz |
Max resolution over VGA | 1920x1200@60Hz |
Graphics API support |
|
DirectX | 11.1/12 |
OpenGL | 4.3 |
Compatibility |
|
Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Package Size | 37.5mm x 37.5mm |
Sockets supported | FCLGA1150 |
Thermal Design Power (TDP) | 35 Watt |
Thermal Solution | PCG 2013A |
Peripherals |
|
Max number of PCIe lanes | 16 |
PCI Express revision | Up to 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 |
Scalability | 1S Only |
Security & Reliability |
|
Execute Disable Bit (EDB) | |
Intel® Secure Key technology | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
|
Enhanced Intel SpeedStep® technology | |
Idle States | |
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 |
Intel 64 | |
Intel® AES New Instructions | |
Intel® Hyper-Threading technology | |
Intel® Optane™ Memory Supported | |
Intel® Stable Image Platform Program (SIPP) | |
Intel® TSX-NI | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Thermal Monitoring | |
Virtualization |
|
Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) | |
Intel® VT-x with Extended Page Tables (EPT) |