Intel Xeon E3-1230 processor review
Xeon E3-1230 processor released by Intel; release date: April 2011. At the time of release, the processor cost $428. The processor is designed for server-computers and based on Sandy Bridge microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 4, threads - 8. Maximum CPU clock speed - 3.60 GHz. Maximum operating temperature - 69.1°C. Manufacturing process technology - 32 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 8192 KB (shared).
Supported memory types: DDR3 1066/1333. Maximum memory size: 32 GB.
Supported socket types: LGA1155. Maximum number of processors in a configuration - 1. Power consumption (TDP): 80 Watt.
Benchmarks
| PassMark Single thread mark |
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| PassMark CPU mark |
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| Geekbench 4 Single Core |
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| Geekbench 4 Multi-Core |
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| 3DMark Fire Strike Physics Score |
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| Name | Value |
|---|---|
| PassMark - Single thread mark | 1665 |
| PassMark - CPU mark | 5137 |
| Geekbench 4 - Single Core | 685 |
| Geekbench 4 - Multi-Core | 2613 |
| 3DMark Fire Strike - Physics Score | 5668 |
Specifications (specs)
Essentials |
|
| Architecture codename | Sandy Bridge |
| Launch date | April 2011 |
| Launch price (MSRP) | $428 |
| Place in performance rating | 1738 |
| Price now | $215 |
| Processor Number | E3-1230 |
| Series | Intel® Xeon® Processor E3 Family |
| Status | Discontinued |
| Value for money (0-100) | 10.75 |
| Vertical segment | Server |
Performance |
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| 64 bit support | |
| Base frequency | 3.20 GHz |
| Bus Speed | 5 GT/s DMI |
| Die size | 216 mm |
| L1 cache | 64 KB (per core) |
| L2 cache | 256 KB (per core) |
| L3 cache | 8192 KB (shared) |
| Manufacturing process technology | 32 nm |
| Maximum core temperature | 69.1°C |
| Maximum frequency | 3.60 GHz |
| Number of cores | 4 |
| Number of threads | 8 |
| Transistor count | 1160 million |
Memory |
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| ECC memory support | |
| Max memory channels | 2 |
| Maximum memory bandwidth | 21 GB/s |
| Maximum memory size | 32 GB |
| Supported memory types | DDR3 1066/1333 |
Graphics |
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| Intel® Clear Video HD technology | |
| Intel® Flexible Display Interface (Intel® FDI) | |
| Intel® InTru™ 3D technology | |
| Intel® Quick Sync Video | |
Graphics interfaces |
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| Wireless Display (WiDi) support | |
Compatibility |
|
| Low Halogen Options Available | |
| Max number of CPUs in a configuration | 1 |
| Package Size | 37.5mm x 37.5mm |
| Sockets supported | LGA1155 |
| Thermal Design Power (TDP) | 80 Watt |
Peripherals |
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| Max number of PCIe lanes | 20 |
| PCI Express revision | 2.0 |
Security & Reliability |
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| Execute Disable Bit (EDB) | |
| Intel® Identity Protection technology | |
| Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | |
| Flexible Display interface (FDI) | |
| Idle States | |
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX |
| Intel 64 | |
| Intel® Advanced Vector Extensions (AVX) | |
| Intel® AES New Instructions | |
| Intel® Demand Based Switching | |
| Intel® Fast Memory Access | |
| Intel® Flex Memory Access | |
| Intel® Hyper-Threading technology | |
| Intel® Turbo Boost technology | |
| Intel® vPro™ Platform Eligibility | |
| Thermal Monitoring | |
Virtualization |
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| Intel® Virtualization Technology (VT-x) | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | |
| Intel® VT-x with Extended Page Tables (EPT) | |
Navigation
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