Intel Xeon E5-1680 v2 vs Intel Xeon E3-1230
Comparative analysis of Intel Xeon E5-1680 v2 and Intel Xeon E3-1230 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces. Benchmark processor performance analysis: CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), 3DMark Fire Strike - Physics Score, PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Xeon E5-1680 v2
- CPU is newer: launch date 2 year(s) 5 month(s) later
- 4 more cores, run more applications at once: 8 vs 4
- 8 more threads: 16 vs 8
- Around 8% higher clock speed: 3.90 GHz vs 3.60 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 3.1x more L3 cache, more data can be stored in the L3 cache for quick access later
- 8x more maximum memory size: 256 GB vs 32 GB
- Around 52% better performance in 3DMark Fire Strike - Physics Score: 8619 vs 5668
Specifications (specs) | |
Launch date | 10 September 2013 vs April 2011 |
Number of cores | 8 vs 4 |
Number of threads | 16 vs 8 |
Maximum frequency | 3.90 GHz vs 3.60 GHz |
Manufacturing process technology | 22 nm vs 32 nm |
L1 cache | 512 KB vs 64 KB (per core) |
L2 cache | 2 MB vs 256 KB (per core) |
L3 cache | 25 MB vs 8192 KB (shared) |
Maximum memory size | 256 GB vs 32 GB |
Benchmarks | |
3DMark Fire Strike - Physics Score | 8619 vs 5668 |
Reasons to consider the Intel Xeon E3-1230
- Around 63% lower typical power consumption: 80 Watt vs 130 Watt
Thermal Design Power (TDP) | 80 Watt vs 130 Watt |
Compare benchmarks
CPU 1: Intel Xeon E5-1680 v2
CPU 2: Intel Xeon E3-1230
3DMark Fire Strike - Physics Score |
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Name | Intel Xeon E5-1680 v2 | Intel Xeon E3-1230 |
---|---|---|
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 8.57 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 123.712 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.994 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 4.217 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 11.267 | |
3DMark Fire Strike - Physics Score | 8619 | 5668 |
PassMark - Single thread mark | 1665 | |
PassMark - CPU mark | 5137 | |
Geekbench 4 - Single Core | 685 | |
Geekbench 4 - Multi-Core | 2613 |
Compare specifications (specs)
Intel Xeon E5-1680 v2 | Intel Xeon E3-1230 | |
---|---|---|
Essentials |
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Architecture codename | Ivy Bridge EP | Sandy Bridge |
Launch date | 10 September 2013 | April 2011 |
Launch price (MSRP) | $1723 | $428 |
Place in performance rating | 1742 | 1738 |
Processor Number | E5-1680V2 | E3-1230 |
Status | Launched | Discontinued |
Vertical segment | Server | Server |
Price now | $215 | |
Series | Intel® Xeon® Processor E3 Family | |
Value for money (0-100) | 10.75 | |
Performance |
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64 bit support | ||
Base frequency | 3.00 GHz | 3.20 GHz |
Bus Speed | 5 GT/s DMI | 5 GT/s DMI |
L1 cache | 512 KB | 64 KB (per core) |
L2 cache | 2 MB | 256 KB (per core) |
L3 cache | 25 MB | 8192 KB (shared) |
Manufacturing process technology | 22 nm | 32 nm |
Maximum case temperature (TCase) | 85 °C | |
Maximum frequency | 3.90 GHz | 3.60 GHz |
Number of cores | 8 | 4 |
Number of threads | 16 | 8 |
Operating Temperature Range | 5°C - 85°C | |
VID voltage range | 0.65–1.30V | |
Die size | 216 mm | |
Maximum core temperature | 69.1°C | |
Transistor count | 1160 million | |
Memory |
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ECC memory support | ||
Max memory channels | 4 | 2 |
Maximum memory bandwidth | 59.7 GB/s | 21 GB/s |
Maximum memory size | 256 GB | 32 GB |
Supported memory types | DDR3 800/1066/1333/1600/1866 | DDR3 1066/1333 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FCLGA2011 | LGA1155 |
Thermal Design Power (TDP) | 130 Watt | 80 Watt |
Package Size | 37.5mm x 37.5mm | |
Peripherals |
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Max number of PCIe lanes | 40 | 20 |
PCI Express revision | 3.0 | 2.0 |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel® Fast Memory Access | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
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Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics interfaces |
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Wireless Display (WiDi) support |