Intel Xeon E5-1680 v2 vs Intel Xeon E3-1230

Comparative analysis of Intel Xeon E5-1680 v2 and Intel Xeon E3-1230 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces. Benchmark processor performance analysis: CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), 3DMark Fire Strike - Physics Score, PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Xeon E5-1680 v2

Intel Xeon E3-1230

Differences

Reasons to consider the Intel Xeon E5-1680 v2

CPU is newer: launch date 2 year(s) 5 month(s) later
4 more cores, run more applications at once: 8 vs 4
8 more threads: 16 vs 8
Around 8% higher clock speed: 3.90 GHz vs 3.60 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
2x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
3.1x more L3 cache, more data can be stored in the L3 cache for quick access later
8x more maximum memory size: 256 GB vs 32 GB
Around 52% better performance in 3DMark Fire Strike - Physics Score: 8619 vs 5668

Specifications (specs)
Launch date	10 September 2013 vs April 2011
Number of cores	8 vs 4
Number of threads	16 vs 8
Maximum frequency	3.90 GHz vs 3.60 GHz
Manufacturing process technology	22 nm vs 32 nm
L1 cache	512 KB vs 64 KB (per core)
L2 cache	2 MB vs 256 KB (per core)
L3 cache	25 MB vs 8192 KB (shared)
Maximum memory size	256 GB vs 32 GB
Benchmarks
3DMark Fire Strike - Physics Score	8619 vs 5668

Reasons to consider the Intel Xeon E3-1230

Around 63% lower typical power consumption: 80 Watt vs 130 Watt

Thermal Design Power (TDP)	80 Watt vs 130 Watt

Compare benchmarks

CPU 1: Intel Xeon E5-1680 v2
CPU 2: Intel Xeon E3-1230

3DMark Fire Strike - Physics Score

CPU 1

CPU 2

8619

5668

Name	Intel Xeon E5-1680 v2	Intel Xeon E3-1230
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	8.57
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	123.712
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.994
CompuBench 1.5 Desktop - Video Composition (Frames/s)	4.217
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	11.267
3DMark Fire Strike - Physics Score	8619	5668
PassMark - Single thread mark		1663
PassMark - CPU mark		5131
Geekbench 4 - Single Core		685
Geekbench 4 - Multi-Core		2613

Compare specifications (specs)

	Intel Xeon E5-1680 v2	Intel Xeon E3-1230
Essentials
Architecture codename	Ivy Bridge EP	Sandy Bridge
Launch date	10 September 2013	April 2011
Launch price (MSRP)	$1723	$428
Place in performance rating	1735	1732
Processor Number	E5-1680V2	E3-1230
Status	Launched	Discontinued
Vertical segment	Server	Server
Price now		$215
Series		Intel® Xeon® Processor E3 Family
Value for money (0-100)		10.75
Performance
64 bit support
Base frequency	3.00 GHz	3.20 GHz
Bus Speed	5 GT/s DMI	5 GT/s DMI
L1 cache	512 KB	64 KB (per core)
L2 cache	2 MB	256 KB (per core)
L3 cache	25 MB	8192 KB (shared)
Manufacturing process technology	22 nm	32 nm
Maximum case temperature (TCase)	85 °C
Maximum frequency	3.90 GHz	3.60 GHz
Number of cores	8	4
Number of threads	16	8
Operating Temperature Range	5°C - 85°C
VID voltage range	0.65–1.30V
Die size		216 mm
Maximum core temperature		69.1°C
Transistor count		1160 million
Memory
ECC memory support
Max memory channels	4	2
Maximum memory bandwidth	59.7 GB/s	21 GB/s
Maximum memory size	256 GB	32 GB
Supported memory types	DDR3 800/1066/1333/1600/1866	DDR3 1066/1333
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Sockets supported	FCLGA2011	LGA1155
Thermal Design Power (TDP)	130 Watt	80 Watt
Package Size		37.5mm x 37.5mm
Peripherals
Max number of PCIe lanes	40	20
PCI Express revision	3.0	2.0
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Flexible Display interface (FDI)
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel® Fast Memory Access
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Graphics
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Graphics interfaces
Wireless Display (WiDi) support