Intel Xeon E5-1607 v3 processor review
Xeon E5-1607 v3 processor released by Intel; release date: 8 Sep 2014. At the time of release, the processor cost $255. The processor is designed for server-computers and based on Haswell microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 4, threads - 4. Maximum operating temperature - 66°C. Manufacturing process technology - 22 nm. Cache size: L1 - 256 KB, L2 - 1 MB, L3 - 10 MB.
Supported memory types: DDR4 1333/1600/1866. Maximum memory size: 768 GB.
Supported socket types: FCLGA2011-3. Maximum number of processors in a configuration - 1. Power consumption (TDP): 140 Watt.
Benchmarks
CompuBench 1.5 Desktop Face Detection |
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CompuBench 1.5 Desktop Ocean Surface Simulation |
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CompuBench 1.5 Desktop T-Rex |
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CompuBench 1.5 Desktop Video Composition |
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CompuBench 1.5 Desktop Bitcoin Mining |
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Name | Value |
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CompuBench 1.5 Desktop - Face Detection | 8.386 mPixels/s |
CompuBench 1.5 Desktop - Ocean Surface Simulation | 91.366 Frames/s |
CompuBench 1.5 Desktop - T-Rex | 0.545 Frames/s |
CompuBench 1.5 Desktop - Video Composition | 1.929 Frames/s |
CompuBench 1.5 Desktop - Bitcoin Mining | 42.254 mHash/s |
Specifications (specs)
Essentials |
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Architecture codename | Haswell |
Launch date | 8 Sep 2014 |
Launch price (MSRP) | $255 |
Place in performance rating | 2225 |
Processor Number | E5-1607V3 |
Series | Intel Xeon Processor E5 v3 Family |
Status | Launched |
Vertical segment | Server |
Performance |
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64 bit support | |
Base frequency | 3.10 GHz |
Bus Speed | 0 GT/s |
L1 cache | 256 KB |
L2 cache | 1 MB |
L3 cache | 10 MB |
Manufacturing process technology | 22 nm |
Maximum core temperature | 66°C |
Number of cores | 4 |
Number of QPI Links | 0 |
Number of threads | 4 |
VID voltage range | 0.65–1.30V |
Memory |
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Max memory channels | 4 |
Maximum memory bandwidth | 59 GB/s |
Maximum memory size | 768 GB |
Supported memory types | DDR4 1333/1600/1866 |
Compatibility |
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Max number of CPUs in a configuration | 1 |
Package Size | 52.5mm x 45.0 mm |
Sockets supported | FCLGA2011-3 |
Thermal Design Power (TDP) | 140 Watt |
Peripherals |
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Max number of PCIe lanes | 40 |
PCI Express revision | 3.0 |
PCIe configurations | x4, x8, x16 |
Scalability | 1S Only |
Security & Reliability |
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Execute Disable Bit (EDB) | |
Intel® Identity Protection technology | |
Intel® OS Guard | |
Intel® Secure Key technology | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
Idle States | |
Instruction set extensions | Intel AVX2 |
Intel 64 | |
Intel® AES New Instructions | |
Intel® Demand Based Switching | |
Intel® Flex Memory Access | |
Intel® Hyper-Threading technology | |
Intel® Turbo Boost technology | |
Physical Address Extensions (PAE) | 46-bit |
Thermal Monitoring | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) | |
Intel® VT-x with Extended Page Tables (EPT) |