Intel Xeon E5-2690 v2 processor review

Intel Xeon E5-2690 v2

Xeon E5-2690 v2 processor released by Intel; release date: September 2013. At the time of release, the processor cost $2,697. The processor is designed for server-computers and based on Ivy Bridge EP microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 10, threads - 20. Maximum CPU clock speed - 3.60 GHz. Maximum operating temperature - 88°C. Manufacturing process technology - 22 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 25600 KB (shared).

Supported memory types: DDR3 800/1066/1333/1600/1866. Maximum memory size: 768 GB.

Supported socket types: FCLGA2011. Maximum number of processors in a configuration - 2. Power consumption (TDP): 130 Watt.

Benchmarks

PassMark
Single thread mark
Top 1 CPU
This CPU
4870
1852
PassMark
CPU mark
Top 1 CPU
This CPU
156834
22018
Geekbench 4
Single Core
Top 1 CPU
This CPU
5311
712
Geekbench 4
Multi-Core
Top 1 CPU
This CPU
36691
6694
Name Value
PassMark - Single thread mark 1852
PassMark - CPU mark 22018
Geekbench 4 - Single Core 712
Geekbench 4 - Multi-Core 6694

Specifications (specs)

Essentials

Architecture codename Ivy Bridge EP
Launch date September 2013
Launch price (MSRP) $2,697
Place in performance rating 1337
Price now $435
Processor Number E5-2690V2
Series Intel® Xeon® Processor E5 v2 Family
Status Launched
Value for money (0-100) 11.18
Vertical segment Server

Performance

64 bit support
Base frequency 3.00 GHz
Bus Speed 8 GT/s QPI
Die size 160 mm
L1 cache 64 KB (per core)
L2 cache 256 KB (per core)
L3 cache 25600 KB (shared)
Manufacturing process technology 22 nm
Maximum core temperature 88°C
Maximum frequency 3.60 GHz
Number of cores 10
Number of QPI Links 2
Number of threads 20
Transistor count 1400 million
VID voltage range 0.65V–1.30V

Memory

ECC memory support
Max memory channels 4
Maximum memory bandwidth 59.7 GB/s
Maximum memory size 768 GB
Supported memory types DDR3 800/1066/1333/1600/1866

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2
Package Size 52.5mm x 45mm
Sockets supported FCLGA2011
Thermal Design Power (TDP) 130 Watt

Peripherals

Max number of PCIe lanes 40
PCI Express revision 3.0
PCIe configurations x4, x8, x16
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)