Intel Xeon E5530 processor review

Xeon E5530 processor released by Intel; release date: March 2009. At the time of release, the processor cost $340. The processor is designed for server-computers and based on Nehalem EP microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 4, threads - 8. Maximum CPU clock speed - 2.66 GHz. Maximum operating temperature - 76°C. Manufacturing process technology - 45 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 8192 KB (shared).

Supported memory types: DDR3 800/1066. Maximum memory size: 144 GB.

Supported socket types: FCLGA1366. Maximum number of processors in a configuration - 2. Power consumption (TDP): 80 Watt.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4871

1155

PassMark
CPU mark

Top 1 CPU

This CPU

156834

5214

Geekbench 4
Single Core

Top 1 CPU

This CPU

5311

2077

Geekbench 4
Multi-Core

Top 1 CPU

This CPU

36691

8140

Name	Value
PassMark - Single thread mark	1155
PassMark - CPU mark	5214
Geekbench 4 - Single Core	2077
Geekbench 4 - Multi-Core	8140

Specifications (specs)

Essentials
Architecture codename	Nehalem EP
Launch date	March 2009
Launch price (MSRP)	$340
Place in performance rating	1265
Price now	$29
Processor Number	E5530
Series	Legacy Intel® Xeon® Processors
Status	Launched
Value for money (0-100)	46.78
Vertical segment	Server
Performance
64 bit support
Base frequency	2.40 GHz
Bus Speed	5.86 GT/s QPI
Die size	263 mm2
L1 cache	64 KB (per core)
L2 cache	256 KB (per core)
L3 cache	8192 KB (shared)
Manufacturing process technology	45 nm
Maximum core temperature	76°C
Maximum frequency	2.66 GHz
Number of cores	4
Number of QPI Links	2
Number of threads	8
Transistor count	731 million
VID voltage range	0.75V -1.35V

Memory
ECC memory support
Max memory channels	3
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	144 GB
Supported memory types	DDR3 800/1066
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	2
Package Size	42.5mm x 45mm
Sockets supported	FCLGA1366
Thermal Design Power (TDP)	80 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)	40-bit
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)