Intel Xeon E5-1680 v2 processor review
Xeon E5-1680 v2 processor released by Intel; release date: 10 September 2013. At the time of release, the processor cost $1723. The processor is designed for server-computers and based on Ivy Bridge EP microarchitecture.
CPU is locked to prevent overclocking. Total number of cores - 8, threads - 16. Maximum CPU clock speed - 3.90 GHz. Manufacturing process technology - 22 nm. Cache size: L1 - 512 KB, L2 - 2 MB, L3 - 25 MB.
Supported memory types: DDR3 800/1066/1333/1600/1866. Maximum memory size: 256 GB.
Supported socket types: FCLGA2011. Maximum number of processors in a configuration - 1. Power consumption (TDP): 130 Watt.
Benchmarks
CompuBench 1.5 Desktop Face Detection |
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CompuBench 1.5 Desktop Ocean Surface Simulation |
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CompuBench 1.5 Desktop T-Rex |
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CompuBench 1.5 Desktop Video Composition |
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CompuBench 1.5 Desktop Bitcoin Mining |
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3DMark Fire Strike Physics Score |
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Name | Value |
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CompuBench 1.5 Desktop - Face Detection | 8.570 mPixels/s |
CompuBench 1.5 Desktop - Ocean Surface Simulation | 123.712 Frames/s |
CompuBench 1.5 Desktop - T-Rex | 0.994 Frames/s |
CompuBench 1.5 Desktop - Video Composition | 4.217 Frames/s |
CompuBench 1.5 Desktop - Bitcoin Mining | 11.267 mHash/s |
3DMark Fire Strike - Physics Score | 8619 |
Specifications (specs)
Essentials |
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Architecture codename | Ivy Bridge EP |
Launch date | 10 September 2013 |
Launch price (MSRP) | $1723 |
Place in performance rating | 1742 |
Processor Number | E5-1680V2 |
Status | Launched |
Vertical segment | Server |
Performance |
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64 bit support | |
Base frequency | 3.00 GHz |
Bus Speed | 5 GT/s DMI |
L1 cache | 512 KB |
L2 cache | 2 MB |
L3 cache | 25 MB |
Manufacturing process technology | 22 nm |
Maximum case temperature (TCase) | 85 °C |
Maximum frequency | 3.90 GHz |
Number of cores | 8 |
Number of threads | 16 |
Operating Temperature Range | 5°C - 85°C |
VID voltage range | 0.65–1.30V |
Memory |
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ECC memory support | |
Max memory channels | 4 |
Maximum memory bandwidth | 59.7 GB/s |
Maximum memory size | 256 GB |
Supported memory types | DDR3 800/1066/1333/1600/1866 |
Compatibility |
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Low Halogen Options Available | |
Max number of CPUs in a configuration | 1 |
Sockets supported | FCLGA2011 |
Thermal Design Power (TDP) | 130 Watt |
Peripherals |
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Max number of PCIe lanes | 40 |
PCI Express revision | 3.0 |
Security & Reliability |
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Execute Disable Bit (EDB) | |
Intel® Identity Protection technology | |
Intel® OS Guard | |
Intel® Trusted Execution technology (TXT) | |
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | |
Idle States | |
Intel 64 | |
Intel® Advanced Vector Extensions (AVX) | |
Intel® AES New Instructions | |
Intel® Demand Based Switching | |
Intel® Flex Memory Access | |
Intel® Hyper-Threading technology | |
Intel® Turbo Boost technology | |
Intel® vPro™ Platform Eligibility | |
Thermal Monitoring | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | |
Intel® Virtualization Technology for Directed I/O (VT-d) | |
Intel® VT-x with Extended Page Tables (EPT) |