Intel Xeon W3570 processor review

Xeon W3570 processor released by Intel; release date: March 2009. At the time of release, the processor cost $480. The processor is designed for server-computers and based on Bloomfield microarchitecture.

CPU is locked to prevent overclocking. Total number of cores - 4, threads - 8. Maximum CPU clock speed - 3.46 GHz. Maximum operating temperature - 67.9°C. Manufacturing process technology - 45 nm. Cache size: L1 - 64 KB (per core), L2 - 256 KB (per core), L3 - 8192 KB (shared).

Supported memory types: DDR3 800/1066/1333. Maximum memory size: 24 GB.

Supported socket types: FCLGA1366. Maximum number of processors in a configuration - 1. Power consumption (TDP): 130 Watt.

Benchmarks

PassMark
Single thread mark

Top 1 CPU

This CPU

4843

1466

PassMark
CPU mark

Top 1 CPU

This CPU

185062

3267

Geekbench 4
Single Core

Top 1 CPU

This CPU

5311

2760

Geekbench 4
Multi-Core

Top 1 CPU

This CPU

36691

9206

Name	Value
PassMark - Single thread mark	1466
PassMark - CPU mark	3267
Geekbench 4 - Single Core	2760
Geekbench 4 - Multi-Core	9206

Specifications (specs)

Essentials
Architecture codename	Bloomfield
Launch date	March 2009
Launch price (MSRP)	$480
Place in performance rating	995
Price now	$479.95
Processor Number	W3570
Series	Legacy Intel® Xeon® Processors
Status	Discontinued
Value for money (0-100)	3.73
Vertical segment	Server
Performance
64 bit support
Base frequency	3.20 GHz
Bus Speed	6.4 GT/s QPI
Die size	263 mm2
L1 cache	64 KB (per core)
L2 cache	256 KB (per core)
L3 cache	8192 KB (shared)
Manufacturing process technology	45 nm
Maximum core temperature	67.9°C
Maximum frequency	3.46 GHz
Number of cores	4
Number of QPI Links	1
Number of threads	8
Transistor count	731 million
VID voltage range	0.800V-1.375V

Memory
ECC memory support
Max memory channels	3
Maximum memory bandwidth	32 GB/s
Maximum memory size	24 GB
Supported memory types	DDR3 800/1066/1333
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	42.5mm x 45.0mm
Sockets supported	FCLGA1366
Thermal Design Power (TDP)	130 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)	36-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® VT-x with Extended Page Tables (EPT)