AMD A4-1250 vs Intel Core 2 Duo SU7300

Comparative analysis of AMD A4-1250 and Intel Core 2 Duo SU7300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD A4-1250

Intel Core 2 Duo SU7300

Differences

Reasons to consider the AMD A4-1250

CPU is newer: launch date 3 year(s) 8 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 45 nm
Around 11% lower typical power consumption: 9 Watt vs 10 Watt

Launch date	23 May 2013 vs 1 September 2009
Manufacturing process technology	28 nm vs 45 nm
Thermal Design Power (TDP)	9 Watt vs 10 Watt

Reasons to consider the Intel Core 2 Duo SU7300

Around 30% higher clock speed: 1.3 GHz vs 1 GHz
3x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 64% better performance in Geekbench 4 - Single Core: 177 vs 108
Around 61% better performance in Geekbench 4 - Multi-Core: 309 vs 192

Specifications (specs)
Maximum frequency	1.3 GHz vs 1 GHz
L2 cache	3 MB vs 1024 KB
Benchmarks
Geekbench 4 - Single Core	177 vs 108
Geekbench 4 - Multi-Core	309 vs 192

Compare benchmarks

CPU 1: AMD A4-1250
CPU 2: Intel Core 2 Duo SU7300

Geekbench 4 - Single Core

CPU 1

CPU 2

108

177

Geekbench 4 - Multi-Core

CPU 1

CPU 2

192

309

Name	AMD A4-1250	Intel Core 2 Duo SU7300
PassMark - Single thread mark	329
PassMark - CPU mark	406
Geekbench 4 - Single Core	108	177
Geekbench 4 - Multi-Core	192	309

Compare specifications (specs)

	AMD A4-1250	Intel Core 2 Duo SU7300
Essentials
Architecture codename	Temash	Penryn
Launch date	23 May 2013	1 September 2009
Place in performance rating	3274	3290
Series	AMD A-Series	Intel Core 2 Duo
Vertical segment	Laptop	Laptop
Performance
64 bit support
Die size	246 mm	107 mm
L1 cache	128 KB
L2 cache	1024 KB	3 MB
Manufacturing process technology	28 nm	45 nm
Maximum case temperature (TCase)	90 °C
Maximum frequency	1 GHz	1.3 GHz
Number of cores	2	2
Number of threads	2	2
Transistor count	1178 million	410 Million
Front-side bus (FSB)		800 MHz
Memory
Supported memory types	DDR3
Compatibility
Max number of CPUs in a configuration	1
Sockets supported	FT3	BGA956
Thermal Design Power (TDP)	9 Watt	10 Watt
Advanced Technologies
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Security & Reliability
Intel® Trusted Execution technology (TXT)