AMD A4-3310MX vs AMD Athlon Neo X2 L325

Comparative analysis of AMD A4-3310MX and AMD Athlon Neo X2 L325 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Virtualization, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD A4-3310MX

AMD Athlon Neo X2 L325

Differences

Reasons to consider the AMD A4-3310MX

CPU is newer: launch date 1 year(s) 9 month(s) later
Around 67% higher clock speed: 2.5 GHz vs 1.5 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 47% better performance in PassMark - Single thread mark: 832 vs 567
Around 41% better performance in PassMark - CPU mark: 782 vs 556

Specifications (specs)
Launch date	14 June 2011 vs 10 September 2009
Maximum frequency	2.5 GHz vs 1.5 GHz
Manufacturing process technology	32 nm vs 65 nm
L2 cache	2048 KB vs 1024 KB
Benchmarks
PassMark - Single thread mark	832 vs 567
PassMark - CPU mark	782 vs 556

Reasons to consider the AMD Athlon Neo X2 L325

2.5x lower typical power consumption: 18 Watt vs 45 Watt

Thermal Design Power (TDP)	18 Watt vs 45 Watt

Compare benchmarks

CPU 1: AMD A4-3310MX
CPU 2: AMD Athlon Neo X2 L325

PassMark - Single thread mark

CPU 1

CPU 2

832

567

PassMark - CPU mark

CPU 1

CPU 2

782

556

Name	AMD A4-3310MX	AMD Athlon Neo X2 L325
PassMark - Single thread mark	832	567
PassMark - CPU mark	782	556
Geekbench 4 - Single Core	274
Geekbench 4 - Multi-Core	463

Compare specifications (specs)

	AMD A4-3310MX	AMD Athlon Neo X2 L325
Essentials
Architecture codename	Llano	Congo
Launch date	14 June 2011	10 September 2009
Place in performance rating	2886	2889
Series	AMD A-Series	2x AMD Athlon Neo
Vertical segment	Laptop	Laptop
Performance
64 bit support
Die size	226 mm
L1 cache	128 KB (per core)
L2 cache	2048 KB	1024 KB
Manufacturing process technology	32 nm	65 nm
Maximum frequency	2.5 GHz	1.5 GHz
Number of cores	2	2
Number of threads	2	2
Transistor count	1000 Million
Front-side bus (FSB)		1600 MHz
Maximum core temperature		95 °C
Memory
Supported memory types	DDR3
Compatibility
Max number of CPUs in a configuration	1
Sockets supported	FS1	ASB1
Thermal Design Power (TDP)	45 Watt	18 Watt
Virtualization
AMD Virtualization (AMD-V™)
Advanced Technologies
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