AMD A4-3310MX vs AMD Mobile Sempron 3300+

Comparative analysis of AMD A4-3310MX and AMD Mobile Sempron 3300+ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD A4-3310MX

  • CPU is newer: launch date 6 year(s) 0 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • 1 more threads: 2 vs 1
  • Around 25% higher clock speed: 2.5 GHz vs 2 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 90 nm
  • 16x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 38% lower typical power consumption: 45 Watt vs 62 / 25 Watt
  • Around 45% better performance in PassMark - Single thread mark: 832 vs 574
  • Around 76% better performance in PassMark - CPU mark: 782 vs 445
Specifications (specs)
Launch date 14 June 2011 vs 1 June 2005
Number of cores 2 vs 1
Number of threads 2 vs 1
Maximum frequency 2.5 GHz vs 2 GHz
Manufacturing process technology 32 nm vs 90 nm
L2 cache 2048 KB vs 128 KB
Thermal Design Power (TDP) 45 Watt vs 62 / 25 Watt
Benchmarks
PassMark - Single thread mark 832 vs 574
PassMark - CPU mark 782 vs 445

Compare benchmarks

CPU 1: AMD A4-3310MX
CPU 2: AMD Mobile Sempron 3300+

PassMark - Single thread mark
CPU 1
CPU 2
832
574
PassMark - CPU mark
CPU 1
CPU 2
782
445
Name AMD A4-3310MX AMD Mobile Sempron 3300+
PassMark - Single thread mark 832 574
PassMark - CPU mark 782 445
Geekbench 4 - Single Core 274
Geekbench 4 - Multi-Core 463

Compare specifications (specs)

AMD A4-3310MX AMD Mobile Sempron 3300+

Essentials

Architecture codename Llano Roma
Launch date 14 June 2011 1 June 2005
Place in performance rating 2875 2884
Series AMD A-Series AMD Mobile Sempron
Vertical segment Laptop Laptop

Performance

64 bit support
Die size 226 mm
L1 cache 128 KB (per core)
L2 cache 2048 KB 128 KB
Manufacturing process technology 32 nm 90 nm
Maximum frequency 2.5 GHz 2 GHz
Number of cores 2 1
Number of threads 2 1
Transistor count 1000 Million
Front-side bus (FSB) 800 MHz

Memory

Supported memory types DDR3

Compatibility

Max number of CPUs in a configuration 1
Sockets supported FS1 745
Thermal Design Power (TDP) 45 Watt 62 / 25 Watt

Virtualization

AMD Virtualization (AMD-V™)