AMD A4-3310MX vs AMD Mobile Sempron 3300+

Comparative analysis of AMD A4-3310MX and AMD Mobile Sempron 3300+ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD A4-3310MX

AMD Mobile Sempron 3300+

Differences

Reasons to consider the AMD A4-3310MX

CPU is newer: launch date 6 year(s) 0 month(s) later
1 more cores, run more applications at once: 2 vs 1
1 more threads: 2 vs 1
Around 25% higher clock speed: 2.5 GHz vs 2 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 90 nm
16x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 38% lower typical power consumption: 45 Watt vs 62 / 25 Watt
Around 45% better performance in PassMark - Single thread mark: 832 vs 574
Around 76% better performance in PassMark - CPU mark: 782 vs 445

Specifications (specs)
Launch date	14 June 2011 vs 1 June 2005
Number of cores	2 vs 1
Number of threads	2 vs 1
Maximum frequency	2.5 GHz vs 2 GHz
Manufacturing process technology	32 nm vs 90 nm
L2 cache	2048 KB vs 128 KB
Thermal Design Power (TDP)	45 Watt vs 62 / 25 Watt
Benchmarks
PassMark - Single thread mark	832 vs 574
PassMark - CPU mark	782 vs 445

Compare benchmarks

CPU 1: AMD A4-3310MX
CPU 2: AMD Mobile Sempron 3300+

PassMark - Single thread mark

CPU 1

CPU 2

832

574

PassMark - CPU mark

CPU 1

CPU 2

782

445

Name	AMD A4-3310MX	AMD Mobile Sempron 3300+
PassMark - Single thread mark	832	574
PassMark - CPU mark	782	445
Geekbench 4 - Single Core	274
Geekbench 4 - Multi-Core	463

Compare specifications (specs)

	AMD A4-3310MX	AMD Mobile Sempron 3300+
Essentials
Architecture codename	Llano	Roma
Launch date	14 June 2011	1 June 2005
Place in performance rating	2886	2896
Series	AMD A-Series	AMD Mobile Sempron
Vertical segment	Laptop	Laptop
Performance
64 bit support
Die size	226 mm
L1 cache	128 KB (per core)
L2 cache	2048 KB	128 KB
Manufacturing process technology	32 nm	90 nm
Maximum frequency	2.5 GHz	2 GHz
Number of cores	2	1
Number of threads	2	1
Transistor count	1000 Million
Front-side bus (FSB)		800 MHz
Memory
Supported memory types	DDR3
Compatibility
Max number of CPUs in a configuration	1
Sockets supported	FS1	745
Thermal Design Power (TDP)	45 Watt	62 / 25 Watt
Virtualization
AMD Virtualization (AMD-V™)