AMD A4-3310MX vs AMD Mobile Sempron 3300+
Comparative analysis of AMD A4-3310MX and AMD Mobile Sempron 3300+ processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD A4-3310MX
- CPU is newer: launch date 6 year(s) 0 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- 1 more threads: 2 vs 1
- Around 25% higher clock speed: 2.5 GHz vs 2 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 90 nm
- 16x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 38% lower typical power consumption: 45 Watt vs 62 / 25 Watt
- Around 45% better performance in PassMark - Single thread mark: 832 vs 574
- Around 76% better performance in PassMark - CPU mark: 782 vs 445
Specifications (specs) | |
Launch date | 14 June 2011 vs 1 June 2005 |
Number of cores | 2 vs 1 |
Number of threads | 2 vs 1 |
Maximum frequency | 2.5 GHz vs 2 GHz |
Manufacturing process technology | 32 nm vs 90 nm |
L2 cache | 2048 KB vs 128 KB |
Thermal Design Power (TDP) | 45 Watt vs 62 / 25 Watt |
Benchmarks | |
PassMark - Single thread mark | 832 vs 574 |
PassMark - CPU mark | 782 vs 445 |
Compare benchmarks
CPU 1: AMD A4-3310MX
CPU 2: AMD Mobile Sempron 3300+
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD A4-3310MX | AMD Mobile Sempron 3300+ |
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PassMark - Single thread mark | 832 | 574 |
PassMark - CPU mark | 782 | 445 |
Geekbench 4 - Single Core | 274 | |
Geekbench 4 - Multi-Core | 463 |
Compare specifications (specs)
AMD A4-3310MX | AMD Mobile Sempron 3300+ | |
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Essentials |
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Architecture codename | Llano | Roma |
Launch date | 14 June 2011 | 1 June 2005 |
Place in performance rating | 2874 | 2883 |
Series | AMD A-Series | AMD Mobile Sempron |
Vertical segment | Laptop | Laptop |
Performance |
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64 bit support | ||
Die size | 226 mm | |
L1 cache | 128 KB (per core) | |
L2 cache | 2048 KB | 128 KB |
Manufacturing process technology | 32 nm | 90 nm |
Maximum frequency | 2.5 GHz | 2 GHz |
Number of cores | 2 | 1 |
Number of threads | 2 | 1 |
Transistor count | 1000 Million | |
Front-side bus (FSB) | 800 MHz | |
Memory |
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Supported memory types | DDR3 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | |
Sockets supported | FS1 | 745 |
Thermal Design Power (TDP) | 45 Watt | 62 / 25 Watt |
Virtualization |
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AMD Virtualization (AMD-V™) |