AMD A4-5050 vs AMD A4-3310MX

Comparative analysis of AMD A4-5050 and AMD A4-3310MX processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD A4-5050

AMD A4-3310MX

Differences

Reasons to consider the AMD A4-5050

CPU is newer: launch date 2 year(s) 7 month(s) later
2 more cores, run more applications at once: 4 vs 2
2 more threads: 4 vs 2
A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 32 nm
3.2x lower typical power consumption: 13.5 Watt vs 45 Watt
Around 70% better performance in PassMark - CPU mark: 1328 vs 782

Specifications (specs)
Launch date	1 February 2014 vs 14 June 2011
Number of cores	4 vs 2
Number of threads	4 vs 2
Manufacturing process technology	28 nm vs 32 nm
Thermal Design Power (TDP)	13.5 Watt vs 45 Watt
Benchmarks
PassMark - CPU mark	1328 vs 782

Reasons to consider the AMD A4-3310MX

Around 61% higher clock speed: 2.5 GHz vs 1.55 GHz
Around 55% better performance in PassMark - Single thread mark: 832 vs 538

Specifications (specs)
Maximum frequency	2.5 GHz vs 1.55 GHz
Benchmarks
PassMark - Single thread mark	832 vs 538

Compare benchmarks

CPU 1: AMD A4-5050
CPU 2: AMD A4-3310MX

PassMark - Single thread mark

CPU 1

CPU 2

538

832

PassMark - CPU mark

CPU 1

CPU 2

1328

782

Name	AMD A4-5050	AMD A4-3310MX
PassMark - Single thread mark	538	832
PassMark - CPU mark	1328	782
Geekbench 4 - Single Core		274
Geekbench 4 - Multi-Core		463

Compare specifications (specs)

	AMD A4-5050	AMD A4-3310MX
Essentials
Architecture codename	Kabini	Llano
Launch date	1 February 2014	14 June 2011
Place in performance rating	2873	2876
Series	AMD A-Series	AMD A-Series
Vertical segment	Laptop	Laptop
Performance
64 bit support
Die size	246 mm	226 mm
L1 cache	256 KB	128 KB (per core)
L2 cache	2 MB	2048 KB
Manufacturing process technology	28 nm	32 nm
Maximum case temperature (TCase)	90 °C
Maximum frequency	1.55 GHz	2.5 GHz
Number of cores	4	2
Number of threads	4	2
Transistor count	1178 million	1000 Million
Memory
Supported memory types	DDR3	DDR3
Compatibility
Max number of CPUs in a configuration	1	1
Sockets supported	FT3	FS1
Thermal Design Power (TDP)	13.5 Watt	45 Watt
Advanced Technologies
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Virtualization
AMD Virtualization (AMD-V™)