AMD A8-7050 vs Intel Pentium G4400TE

Comparative analysis of AMD A8-7050 and Intel Pentium G4400TE processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Peripherals, Security & Reliability. Benchmark processor performance analysis: CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD A8-7050

  • Around 75% lower typical power consumption: 20 Watt vs 35 Watt
Thermal Design Power (TDP) 20 Watt vs 35 Watt

Reasons to consider the Intel Pentium G4400TE

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 28 nm
Manufacturing process technology 14 nm vs 28 nm

Compare benchmarks

CPU 1: AMD A8-7050
CPU 2: Intel Pentium G4400TE

Name AMD A8-7050 Intel Pentium G4400TE
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 6.049
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 217.952
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.619
PassMark - Single thread mark 1481
PassMark - CPU mark 2190

Compare specifications (specs)

AMD A8-7050 Intel Pentium G4400TE

Essentials

Architecture codename Bald Eagle Skylake
Launch date Q3'14 Q4'15
Place in performance rating 1630 1631
Vertical segment Laptop Embedded
Processor Number G4400TE
Series Intel® Pentium® Processor G Series
Status Launched

Performance

64 bit support
Base frequency 2.20 GHz 2.40 GHz
Bus Speed 100 MHz 8 GT/s DMI3
L2 cache 1024 KB
Manufacturing process technology 28 nm 14 nm
Maximum core temperature 100 °C
Number of cores 2 2
Number of threads 2 2
VID voltage range 1.012 V

Compatibility

Sockets supported FP3 (906) FCLGA1151
Thermal Design Power (TDP) 20 Watt 35 Watt
Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mm x 37.5mm
Thermal Solution PCG 2015A (35W)

Advanced Technologies

Fused Multiply-Add 3 (FMA3)
Fused Multiply-Add 4 (FMA4)
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Memory

Max memory channels 2
Maximum memory bandwidth 34.1 GB/s
Maximum memory size 64 GB
Supported memory types DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V

Graphics

Device ID 0x1902
Graphics base frequency 350 MHz
Graphics max dynamic frequency 950 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 64 GB
Processor graphics Intel® HD Graphics 510

Graphics interfaces

DisplayPort
DVI
eDP
HDMI
Number of displays supported 3

Graphics image quality

4K resolution support
Max resolution over DisplayPort 4096x2304@60Hz
Max resolution over eDP 4096x2304@60Hz
Max resolution over HDMI 1.4 4096x2304@24Hz

Graphics API support

DirectX 12
OpenGL 4.4

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3.0
PCIe configurations Up to 1x16, 2x8, 1x8+2x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot