AMD A8-7050 vs Intel Celeron G3900E

Comparative analysis of AMD A8-7050 and Intel Celeron G3900E processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Peripherals, Security & Reliability. Benchmark processor performance analysis: CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), PassMark - Single thread mark, PassMark - CPU mark.

AMD A8-7050

Intel Celeron G3900E

Differences

Reasons to consider the AMD A8-7050

Around 75% lower typical power consumption: 20 Watt vs 35 Watt

Thermal Design Power (TDP)	20 Watt vs 35 Watt

Reasons to consider the Intel Celeron G3900E

A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 28 nm

Manufacturing process technology	14 nm vs 28 nm

Compare benchmarks

CPU 1: AMD A8-7050
CPU 2: Intel Celeron G3900E

Name	AMD A8-7050	Intel Celeron G3900E
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	6.049
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	217.952
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.619
PassMark - Single thread mark		1499
PassMark - CPU mark		2034

Compare specifications (specs)

	AMD A8-7050	Intel Celeron G3900E
Essentials
Architecture codename	Bald Eagle	Skylake
Launch date	Q3'14	Q1'16
Place in performance rating	1700	1723
Vertical segment	Laptop	Embedded
Processor Number		G3900E
Series		Intel® Celeron® Processor G Series
Status		Launched
Performance
64 bit support
Base frequency	2.20 GHz	2.40 GHz
Bus Speed	100 MHz	8 GT/s DMI3
L2 cache	1024 KB
Manufacturing process technology	28 nm	14 nm
Maximum core temperature	100 °C	100°C
Number of cores	2	2
Number of threads	2	2
VID voltage range	1.012 V
Compatibility
Sockets supported	FP3 (906)	FCBGA1440
Thermal Design Power (TDP)	20 Watt	35 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Package Size		42mm x 28mm
Advanced Technologies
Fused Multiply-Add 3 (FMA3)
Fused Multiply-Add 4 (FMA4)
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Memory
Max memory channels		2
Maximum memory bandwidth		34.1 GB/s
Maximum memory size		64 GB
Supported memory types		DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V
Graphics
Device ID		0x1902
Graphics base frequency		350 MHz
Graphics max dynamic frequency		950 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory		64 GB
Processor graphics		Intel® HD Graphics 510
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported		3
Graphics image quality
4K resolution support
Max resolution over DisplayPort		4096x2304@60Hz
Max resolution over eDP		4096x2304@60Hz
Max resolution over HDMI 1.4		4096x2304@24Hz
Graphics API support
DirectX		12
OpenGL		4.4
Peripherals
Max number of PCIe lanes		16
PCI Express revision		3.0
PCIe configurations		Up to 1x16, 2x8, 1x8+2x4
Scalability		1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot