AMD Ryzen 5 7520U vs Apple A12X Bionic

Comparative analysis of AMD Ryzen 5 7520U and Apple A12X Bionic processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Ryzen 5 7520U

  • CPU is newer: launch date 3 year(s) 10 month(s) later
  • Around 73% higher clock speed: 4.3 GHz vs 2.49 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 7 nm
  • 256x more L1 cache, more data can be stored in the L1 cache for quick access later
Launch date 20 Sep 2022 vs 7 Nov 2018
Maximum frequency 4.3 GHz vs 2.49 GHz
Manufacturing process technology 6 nm vs 7 nm
L1 cache 64K (per core) vs 128 KB instruction + 128 KB data (per core)

Reasons to consider the Apple A12X Bionic

  • 4 more cores, run more applications at once: 8 vs 4
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 7% better performance in PassMark - Single thread mark: 2655 vs 2491
  • Around 18% better performance in PassMark - CPU mark: 11037 vs 9315
Specifications (specs)
Number of cores 8 vs 4
L2 cache 8 MB (shared) vs 512K (per core)
Benchmarks
PassMark - Single thread mark 2655 vs 2491
PassMark - CPU mark 11037 vs 9315

Compare benchmarks

CPU 1: AMD Ryzen 5 7520U
CPU 2: Apple A12X Bionic

PassMark - Single thread mark
CPU 1
CPU 2
2491
2655
PassMark - CPU mark
CPU 1
CPU 2
9315
11037
Name AMD Ryzen 5 7520U Apple A12X Bionic
PassMark - Single thread mark 2491 2655
PassMark - CPU mark 9315 11037

Compare specifications (specs)

AMD Ryzen 5 7520U Apple A12X Bionic

Essentials

Architecture codename Mendocino Vortex/Tempest/Chinook
Launch date 20 Sep 2022 7 Nov 2018
Place in performance rating 842 734
OS Support iOS 12.1, iOS 16.4.1, iPadOS 16.4.1, tvOS 16.2
Processor Number APL1083
Vertical segment Mobile

Performance

Base frequency 2.8 GHz 1.59 GHz
Die size 100 mm²
L1 cache 64K (per core) 128 KB instruction + 128 KB data (per core)
L2 cache 512K (per core) 8 MB (shared)
L3 cache 4MB (shared)
Manufacturing process technology 6 nm 7 nm
Maximum core temperature 95°C
Maximum frequency 4.3 GHz 2.49 GHz
Number of cores 4 8
Number of threads 8 8
Unlocked
Transistor count 10 billion

Memory

ECC memory support
Supported memory types DDR5, Dual-channel LPDDR4X-4266
Max memory channels 2
Maximum memory bandwidth 68.2 GB/s
Maximum memory size 6 GB

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported FP6
Thermal Design Power (TDP) 15 Watt 15 Watt

Peripherals

PCIe configurations Gen 3, 4 Lanes, (CPU only)

Graphics

Execution Units 28
Graphics base frequency 1125 MHz
Graphics max frequency 7