AMD Athlon Neo X2 L325 vs AMD Mobile Sempron 3300+

Comparative analysis of AMD Athlon Neo X2 L325 and AMD Mobile Sempron 3300+ processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Athlon Neo X2 L325

  • CPU is newer: launch date 4 year(s) 3 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • 1 more threads: 2 vs 1
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
  • 8x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 3.4x lower typical power consumption: 18 Watt vs 62 / 25 Watt
  • Around 25% better performance in PassMark - CPU mark: 556 vs 445
Specifications (specs)
Launch date 10 September 2009 vs 1 June 2005
Number of cores 2 vs 1
Number of threads 2 vs 1
Manufacturing process technology 65 nm vs 90 nm
L2 cache 1024 KB vs 128 KB
Thermal Design Power (TDP) 18 Watt vs 62 / 25 Watt
Benchmarks
PassMark - CPU mark 556 vs 445

Reasons to consider the AMD Mobile Sempron 3300+

  • Around 33% higher clock speed: 2 GHz vs 1.5 GHz
  • Around 1% better performance in PassMark - Single thread mark: 574 vs 567
Specifications (specs)
Maximum frequency 2 GHz vs 1.5 GHz
Benchmarks
PassMark - Single thread mark 574 vs 567

Compare benchmarks

CPU 1: AMD Athlon Neo X2 L325
CPU 2: AMD Mobile Sempron 3300+

PassMark - Single thread mark
CPU 1
CPU 2
567
574
PassMark - CPU mark
CPU 1
CPU 2
556
445
Name AMD Athlon Neo X2 L325 AMD Mobile Sempron 3300+
PassMark - Single thread mark 567 574
PassMark - CPU mark 556 445

Compare specifications (specs)

AMD Athlon Neo X2 L325 AMD Mobile Sempron 3300+

Essentials

Architecture codename Congo Roma
Launch date 10 September 2009 1 June 2005
Place in performance rating 2877 2883
Series 2x AMD Athlon Neo AMD Mobile Sempron
Vertical segment Laptop Laptop

Performance

64 bit support
Front-side bus (FSB) 1600 MHz 800 MHz
L2 cache 1024 KB 128 KB
Manufacturing process technology 65 nm 90 nm
Maximum core temperature 95 °C
Maximum frequency 1.5 GHz 2 GHz
Number of cores 2 1
Number of threads 2 1

Compatibility

Sockets supported ASB1 745
Thermal Design Power (TDP) 18 Watt 62 / 25 Watt

Advanced Technologies

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