AMD EPYC 7302P vs AMD EPYC 7742

Comparative analysis of AMD EPYC 7302P and AMD EPYC 7742 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD EPYC 7302P

  • Around 45% lower typical power consumption: 155 Watt vs 225 Watt
Thermal Design Power (TDP) 155 Watt vs 225 Watt

Reasons to consider the AMD EPYC 7742

  • 48 more cores, run more applications at once: 64 vs 16
  • 96 more threads: 128 vs 32
  • Around 3% higher clock speed: 3.4 GHz vs 3.3 GHz
  • 4x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 2x more L3 cache, more data can be stored in the L3 cache for quick access later
Number of cores 64 vs 16
Number of threads 128 vs 32
Maximum frequency 3.4 GHz vs 3.3 GHz
L1 cache 4 MB vs 1 MB
L2 cache 32 MB vs 8 MB
L3 cache 256 MB vs 128 MB

Compare benchmarks

CPU 1: AMD EPYC 7302P
CPU 2: AMD EPYC 7742

Name AMD EPYC 7302P AMD EPYC 7742
PassMark - Single thread mark 0 0
PassMark - CPU mark 0 0

Compare specifications (specs)

AMD EPYC 7302P AMD EPYC 7742

Essentials

Architecture codename Zen 2 Zen 2
Launch date 7 Aug 2019 7 Aug 2019
Launch price (MSRP) $825
OPN PIB 100-100000049WOF
OPN Tray 100-000000049
Place in performance rating 2095 2130
Vertical segment Server Server

Performance

Base frequency 3.0 GHz 2.25 GHz
L1 cache 1 MB 4 MB
L2 cache 8 MB 32 MB
L3 cache 128 MB 256 MB
Manufacturing process technology 7 nm, 14 nm 7 nm, 14 nm
Maximum frequency 3.3 GHz 3.4 GHz
Number of cores 16 64
Number of threads 32 128
Unlocked

Memory

ECC memory support
Max memory channels 8 8
Maximum memory bandwidth 190.7 GB/s 190.7 GB/s
Maximum memory size 4 TB 4 TB
Supported memory types DDR4-3200 DDR4-3200

Compatibility

Socket Count 1P
Sockets supported SP3 SP3
Thermal Design Power (TDP) 155 Watt 225 Watt
Max number of CPUs in a configuration 2

Peripherals

Max number of PCIe lanes 128 128
PCI Express revision 4.0 4.0
PCIe configurations x16, x8 x16, x8

Advanced Technologies

AMD SenseMI
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions

Virtualization

AMD Virtualization (AMD-V™)