AMD EPYC 7302P vs Intel Xeon E-2124G
Comparative analysis of AMD EPYC 7302P and Intel Xeon E-2124G processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 7302P
- CPU is newer: launch date 1 year(s) 3 month(s) later
- 12 more cores, run more applications at once: 16 vs 4
- 28 more threads: 32 vs 4
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm, 14 nm vs 14 nm
- 4x more L1 cache, more data can be stored in the L1 cache for quick access later
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- 16x more L3 cache, more data can be stored in the L3 cache for quick access later
- 32x more maximum memory size: 4 TB vs 128 GB
- 4.4x better performance in PassMark - CPU mark: 32626 vs 7365
Specifications (specs) | |
Launch date | 7 Aug 2019 vs May 2018 |
Number of cores | 16 vs 4 |
Number of threads | 32 vs 4 |
Manufacturing process technology | 7 nm, 14 nm vs 14 nm |
L1 cache | 1 MB vs 64K (per core) |
L2 cache | 8 MB vs 256K (per core) |
L3 cache | 128 MB vs 8 MB (shared) |
Maximum memory size | 4 TB vs 128 GB |
Benchmarks | |
PassMark - CPU mark | 32626 vs 7365 |
Reasons to consider the Intel Xeon E-2124G
- Around 36% higher clock speed: 4.50 GHz vs 3.3 GHz
- 2.2x lower typical power consumption: 71 Watt vs 155 Watt
- Around 43% better performance in PassMark - Single thread mark: 2686 vs 1877
Specifications (specs) | |
Maximum frequency | 4.50 GHz vs 3.3 GHz |
Thermal Design Power (TDP) | 71 Watt vs 155 Watt |
Benchmarks | |
PassMark - Single thread mark | 2686 vs 1877 |
Compare benchmarks
CPU 1: AMD EPYC 7302P
CPU 2: Intel Xeon E-2124G
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD EPYC 7302P | Intel Xeon E-2124G |
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PassMark - Single thread mark | 1877 | 2686 |
PassMark - CPU mark | 32626 | 7365 |
Compare specifications (specs)
AMD EPYC 7302P | Intel Xeon E-2124G | |
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Essentials |
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Architecture codename | Zen 2 | Coffee Lake |
Launch date | 7 Aug 2019 | May 2018 |
Launch price (MSRP) | $825 | |
OPN PIB | 100-100000049WOF | |
OPN Tray | 100-000000049 | |
Place in performance rating | 898 | 889 |
Vertical segment | Server | Server |
Processor Number | E-2124G | |
Series | Intel® Xeon® E Processor | |
Status | Launched | |
Performance |
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Base frequency | 3.0 GHz | 3.40 GHz |
L1 cache | 1 MB | 64K (per core) |
L2 cache | 8 MB | 256K (per core) |
L3 cache | 128 MB | 8 MB (shared) |
Manufacturing process technology | 7 nm, 14 nm | 14 nm |
Maximum frequency | 3.3 GHz | 4.50 GHz |
Number of cores | 16 | 4 |
Number of threads | 32 | 4 |
Unlocked | ||
64 bit support | ||
Bus Speed | 8 GT/s DMI3 | |
Die size | 126 mm | |
Transistor count | 1400 million | |
Memory |
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ECC memory support | ||
Max memory channels | 8 | 2 |
Maximum memory bandwidth | 190.7 GB/s | 41.6 GB/s |
Maximum memory size | 4 TB | 128 GB |
Supported memory types | DDR4-3200 | DDR4-2666 |
Compatibility |
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Socket Count | 1P | |
Sockets supported | SP3 | FCLGA1151 |
Thermal Design Power (TDP) | 155 Watt | 71 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Peripherals |
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Max number of PCIe lanes | 128 | 16 |
PCI Express revision | 4.0 | 3.0 |
PCIe configurations | x16, x8 | 1x16,2x8,1x8+2x4 |
Scalability | 1S Only | |
Advanced Technologies |
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AMD SenseMI | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
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Device ID | 0x3E96 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.15 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 128 GB | |
Processor graphics | Intel® UHD Graphics P630 | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2160@24Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot |