AMD EPYC 7352 vs Intel Xeon E7-8890 v4
Comparative analysis of AMD EPYC 7352 and Intel Xeon E7-8890 v4 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 7352
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm, 14 nm vs 14 nm
- Around 33% higher maximum memory size: 4 TB vs 3 TB
- Around 6% lower typical power consumption: 155 Watt vs 165 Watt
| Manufacturing process technology | 7 nm, 14 nm vs 14 nm |
| Maximum memory size | 4 TB vs 3 TB |
| Thermal Design Power (TDP) | 155 Watt vs 165 Watt |
Reasons to consider the Intel Xeon E7-8890 v4
- Around 6% higher clock speed: 3.40 GHz vs 3.2 GHz
- Around 3% better performance in PassMark - Single thread mark: 2110 vs 2040
- Around 4% better performance in PassMark - CPU mark: 68717 vs 65921
| Specifications (specs) | |
| Maximum frequency | 3.40 GHz vs 3.2 GHz |
| Max number of CPUs in a configuration | 8 vs 2 |
| Benchmarks | |
| PassMark - Single thread mark | 2110 vs 2040 |
| PassMark - CPU mark | 68717 vs 65921 |
Compare benchmarks
CPU 1: AMD EPYC 7352
CPU 2: Intel Xeon E7-8890 v4
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD EPYC 7352 | Intel Xeon E7-8890 v4 |
|---|---|---|
| PassMark - Single thread mark | 2040 | 2110 |
| PassMark - CPU mark | 65921 | 68717 |
Compare specifications (specs)
| AMD EPYC 7352 | Intel Xeon E7-8890 v4 | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 2 | Broadwell |
| Launch date | 7 Aug 2019 | Q2'16 |
| Launch price (MSRP) | $1350 | |
| OPN PIB | 100-100000077WOF | |
| OPN Tray | 100-000000077 | |
| Place in performance rating | 455 | 411 |
| Vertical segment | Server | Server |
| Processor Number | E7-8890V4 | |
| Series | Intel® Xeon® Processor E7 v4 Family | |
| Status | Launched | |
Performance |
||
| Base frequency | 2.3 GHz | 2.20 GHz |
| L1 cache | 1.5 MB | |
| L2 cache | 12 MB | |
| L3 cache | 128 MB | |
| Manufacturing process technology | 7 nm, 14 nm | 14 nm |
| Maximum frequency | 3.2 GHz | 3.40 GHz |
| Number of cores | 24 | 24 |
| Number of threads | 48 | 48 |
| 64 bit support | ||
| Bus Speed | 9.6 GT/s QPI | |
| Maximum core temperature | 79°C | |
| Number of QPI Links | 3 | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 8 | 4 |
| Maximum memory bandwidth | 190.7 GB/s | 85 GB/s |
| Maximum memory size | 4 TB | 3 TB |
| Supported memory types | DDR4-3200 | DDR4-1333/1600/1866 DDR3-1066/1333/1600 |
Compatibility |
||
| Max number of CPUs in a configuration | 2 | 8 |
| Socket Count | 1P/2P | |
| Sockets supported | SP3 | FCLGA2011 |
| Thermal Design Power (TDP) | 155 Watt | 165 Watt |
| Low Halogen Options Available | ||
| Package Size | 45mm x 52.5mm | |
Peripherals |
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| Max number of PCIe lanes | 128 | 32 |
| PCI Express revision | 4.0 | 3.0 |
| PCIe configurations | x16, x8 | x4, x8, x16 |
| Scalability | S8S | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® Instruction Replay Technology | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 46-bit | |
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||