AMD EPYC 8124P vs Intel Xeon Gold 6122
Comparative analysis of AMD EPYC 8124P and Intel Xeon Gold 6122 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD EPYC 8124P
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
- 2.3x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 6% better performance in PassMark - Single thread mark: 2338 vs 2202
Specifications (specs) | |
Manufacturing process technology | 5 nm vs 14 nm |
L3 cache | 64 MB (shared) vs 28 MB |
Benchmarks | |
PassMark - Single thread mark | 2338 vs 2202 |
Reasons to consider the Intel Xeon Gold 6122
- 4 more cores, run more applications at once: 20 vs 16
- 8 more threads: 40 vs 32
- Around 23% higher clock speed: 3.70 GHz vs 3 GHz
- Around 4% lower typical power consumption: 120 Watt vs 125 Watt
- Around 12% better performance in PassMark - CPU mark: 40707 vs 36338
Specifications (specs) | |
Number of cores | 20 vs 16 |
Number of threads | 40 vs 32 |
Maximum frequency | 3.70 GHz vs 3 GHz |
Thermal Design Power (TDP) | 120 Watt vs 125 Watt |
Benchmarks | |
PassMark - CPU mark | 40707 vs 36338 |
Compare benchmarks
CPU 1: AMD EPYC 8124P
CPU 2: Intel Xeon Gold 6122
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD EPYC 8124P | Intel Xeon Gold 6122 |
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PassMark - Single thread mark | 2338 | 2202 |
PassMark - CPU mark | 36338 | 40707 |
Compare specifications (specs)
AMD EPYC 8124P | Intel Xeon Gold 6122 | |
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Essentials |
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Launch date | 18 Sep 2023 | Q2'18 |
Launch price (MSRP) | $639 | $2002 |
Place in performance rating | 645 | 646 |
Architecture codename | Skylake | |
Processor Number | 6122 | |
Series | Intel Xeon Scalable Processors | |
Vertical segment | Server | |
Performance |
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Base frequency | 2.45 GHz | 1.80 GHz |
Die size | 2x 73 mm² | |
L1 cache | 64 KB (per core) | |
L2 cache | 1 MB (per core) | |
L3 cache | 64 MB (shared) | 28 MB |
Manufacturing process technology | 5 nm | 14 nm |
Maximum case temperature (TCase) | 75°C | |
Maximum frequency | 3 GHz | 3.70 GHz |
Number of cores | 16 | 20 |
Number of threads | 32 | 40 |
Transistor count | 17,750 million | |
Unlocked | ||
Memory |
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ECC memory support | ||
Supported memory types | DDR5 | DDR4-2400 |
Max memory channels | 6 | |
Maximum memory size | 768 GB | |
Supported memory frequency | 2400 MHz | |
Compatibility |
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Configurable TDP | 120-150 Watt | |
Max number of CPUs in a configuration | 1 | |
Sockets supported | SP6 | FCLGA3647 |
Thermal Design Power (TDP) | 125 Watt | 120 Watt |
Package Size | 76.0mm x 56.5mm | |
Peripherals |
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PCIe configurations | Gen 5, 96 Lanes, (CPU only) | |
Max number of PCIe lanes | 48 | |
PCI Express revision | 3.0 | |
Scalability | 2S | |
Security & Reliability |
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Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Instruction set extensions | Intel AVX-512 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Turbo Boost technology | ||
Number of AVX-512 FMA Units | 1 | |
Speed Shift technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |