AMD EPYC 8124P vs AMD EPYC 7302

Comparative analysis of AMD EPYC 8124P and AMD EPYC 7302 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD EPYC 8124P

AMD EPYC 7302

Differences

Reasons to consider the AMD EPYC 8124P

CPU is newer: launch date 4 year(s) 1 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 7 nm, 14 nm
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 24% lower typical power consumption: 125 Watt vs 155 Watt
Around 23% better performance in PassMark - Single thread mark: 2372 vs 1936

Specifications (specs)
Launch date	18 Sep 2023 vs 7 Aug 2019
Manufacturing process technology	5 nm vs 7 nm, 14 nm
L2 cache	1 MB (per core) vs 8 MB
Thermal Design Power (TDP)	125 Watt vs 155 Watt
Benchmarks
PassMark - Single thread mark	2372 vs 1936

Reasons to consider the AMD EPYC 7302

Around 10% higher clock speed: 3.3 GHz vs 3 GHz
2x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 40% better performance in PassMark - CPU mark: 51405 vs 36630

Specifications (specs)
Maximum frequency	3.3 GHz vs 3 GHz
L3 cache	128 MB vs 64 MB (shared)
Benchmarks
PassMark - CPU mark	51405 vs 36630

Compare benchmarks

CPU 1: AMD EPYC 8124P
CPU 2: AMD EPYC 7302

PassMark - Single thread mark

CPU 1

CPU 2

2372

1936

PassMark - CPU mark

CPU 1

CPU 2

36630

51405

Name	AMD EPYC 8124P	AMD EPYC 7302
PassMark - Single thread mark	2372	1936
PassMark - CPU mark	36630	51405

Compare specifications (specs)

	AMD EPYC 8124P	AMD EPYC 7302
Essentials
Launch date	18 Sep 2023	7 Aug 2019
Launch price (MSRP)	$639	$978
Place in performance rating	626	619
Architecture codename		Zen 2
OPN PIB		100-100000043WOF
OPN Tray		100-000000043
Vertical segment		Server
Performance
Base frequency	2.45 GHz	3.0 GHz
Die size	2x 73 mm²
L1 cache	64 KB (per core)	1 MB
L2 cache	1 MB (per core)	8 MB
L3 cache	64 MB (shared)	128 MB
Manufacturing process technology	5 nm	7 nm, 14 nm
Maximum case temperature (TCase)	75°C
Maximum frequency	3 GHz	3.3 GHz
Number of cores	16	16
Number of threads	32	32
Transistor count	17,750 million
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	DDR4-3200
Max memory channels		8
Maximum memory bandwidth		204.8 GB/s
Maximum memory size		4 TB
Compatibility
Configurable TDP	120-150 Watt
Max number of CPUs in a configuration	1
Sockets supported	SP6	SP3
Thermal Design Power (TDP)	125 Watt	155 Watt
Socket Count		1P/2P
Peripherals
PCIe configurations	Gen 5, 96 Lanes, (CPU only)	x16, x8
Max number of PCIe lanes		128
PCI Express revision		4.0
Advanced Technologies
AMD SenseMI
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Virtualization
AMD Virtualization (AMD-V™)