AMD EPYC 8324P vs AMD EPYC 7532

Comparative analysis of AMD EPYC 8324P and AMD EPYC 7532 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD EPYC 8324P

AMD EPYC 7532

Differences

Reasons to consider the AMD EPYC 8324P

CPU is newer: launch date 3 year(s) 6 month(s) later
A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 7 nm, 14 nm
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 11% lower typical power consumption: 180 Watt vs 200 Watt
Around 16% better performance in PassMark - Single thread mark: 2367 vs 2039

Specifications (specs)
Launch date	18 Sep 2023 vs 19 Feb 2020
Manufacturing process technology	5 nm vs 7 nm, 14 nm
L2 cache	1 MB (per core) vs 16 MB
Thermal Design Power (TDP)	180 Watt vs 200 Watt
Benchmarks
PassMark - Single thread mark	2367 vs 2039

Reasons to consider the AMD EPYC 7532

Around 10% higher clock speed: 3.3 GHz vs 3 GHz
2x more L3 cache, more data can be stored in the L3 cache for quick access later
Around 37% better performance in PassMark - CPU mark: 78110 vs 57127

Specifications (specs)
Maximum frequency	3.3 GHz vs 3 GHz
L3 cache	256 MB vs 128 MB (shared)
Benchmarks
PassMark - CPU mark	78110 vs 57127

Compare benchmarks

CPU 1: AMD EPYC 8324P
CPU 2: AMD EPYC 7532

PassMark - Single thread mark

CPU 1

CPU 2

2367

2039

PassMark - CPU mark

CPU 1

CPU 2

57127

78110

Name	AMD EPYC 8324P	AMD EPYC 7532
PassMark - Single thread mark	2367	2039
PassMark - CPU mark	57127	78110

Compare specifications (specs)

	AMD EPYC 8324P	AMD EPYC 7532
Essentials
Launch date	18 Sep 2023	19 Feb 2020
Launch price (MSRP)	$1895
Place in performance rating	418	345
Architecture codename		Zen 2
OPN PIB		100-000000136WOF
OPN Tray		100-000000136
Vertical segment		Server
Performance
Base frequency	2.65 GHz	2.4 GHz
Die size	4x 73 mm²
L1 cache	64 KB (per core)	2 MB
L2 cache	1 MB (per core)	16 MB
L3 cache	128 MB (shared)	256 MB
Manufacturing process technology	5 nm	7 nm, 14 nm
Maximum case temperature (TCase)	75°C
Maximum frequency	3 GHz	3.3 GHz
Number of cores	32	32
Number of threads	64	64
Transistor count	35,500 million
Unlocked
Memory
ECC memory support
Supported memory types	DDR5	DDR4-3200
Max memory channels		8
Maximum memory bandwidth		190.7 GB/s
Maximum memory size		4 TB
Compatibility
Configurable TDP	155-225 Watt
Max number of CPUs in a configuration	1
Sockets supported	SP6	SP3
Thermal Design Power (TDP)	180 Watt	200 Watt
Socket Count		1P/2P
Peripherals
PCIe configurations	Gen 5, 96 Lanes, (CPU only)	x16, x8
Max number of PCIe lanes		128
PCI Express revision		4.0
Advanced Technologies
AMD SenseMI
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Virtualization
AMD Virtualization (AMD-V™)