AMD EPYC 8324P vs Intel Xeon E5-2651 v2
Comparative analysis of AMD EPYC 8324P and Intel Xeon E5-2651 v2 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD EPYC 8324P
- CPU is newer: launch date 9 year(s) 10 month(s) later
- 20 more cores, run more applications at once: 32 vs 12
- 40 more threads: 64 vs 24
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 22 nm
- 2.7x more L1 cache, more data can be stored in the L1 cache for quick access later
- 10.7x more L2 cache, more data can be stored in the L2 cache for quick access later
- 4.3x more L3 cache, more data can be stored in the L3 cache for quick access later
Launch date | 18 Sep 2023 vs November 2013 |
Number of cores | 32 vs 12 |
Number of threads | 64 vs 24 |
Manufacturing process technology | 5 nm vs 22 nm |
L1 cache | 64 KB (per core) vs 768 KB |
L2 cache | 1 MB (per core) vs 3 MB |
L3 cache | 128 MB (shared) vs 30 MB |
Reasons to consider the Intel Xeon E5-2651 v2
Max number of CPUs in a configuration | 2 vs 1 |
Compare benchmarks
CPU 1: AMD EPYC 8324P
CPU 2: Intel Xeon E5-2651 v2
Name | AMD EPYC 8324P | Intel Xeon E5-2651 v2 |
---|---|---|
PassMark - Single thread mark | 2367 | |
PassMark - CPU mark | 57127 | |
Geekbench 4 - Single Core | 2030 | |
Geekbench 4 - Multi-Core | 18071 |
Compare specifications (specs)
AMD EPYC 8324P | Intel Xeon E5-2651 v2 | |
---|---|---|
Essentials |
||
Launch date | 18 Sep 2023 | November 2013 |
Launch price (MSRP) | $1895 | |
Place in performance rating | 365 | 327 |
Architecture codename | Ivy Bridge-EP | |
Family | Intel Xeon E5-2600 v2 | |
Processor Number | E5-2651 v2 | |
Vertical segment | Server | |
Performance |
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Base frequency | 2.65 GHz | 1800 MHz |
Die size | 4x 73 mm² | |
L1 cache | 64 KB (per core) | 768 KB |
L2 cache | 1 MB (per core) | 3 MB |
L3 cache | 128 MB (shared) | 30 MB |
Manufacturing process technology | 5 nm | 22 nm |
Maximum case temperature (TCase) | 75°C | |
Maximum frequency | 3 GHz | |
Number of cores | 32 | 12 |
Number of threads | 64 | 24 |
Transistor count | 35,500 million | |
Unlocked | ||
64 bit support | ||
Bus Speed | 5 GT/s DMI | |
Memory |
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ECC memory support | ||
Supported memory types | DDR5 | DDR3 |
Max memory channels | 4 | |
Maximum memory size | 768 GB (per socket) | |
Compatibility |
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Configurable TDP | 155-225 Watt | |
Max number of CPUs in a configuration | 1 | 2 |
Sockets supported | SP6 | LGA2011 |
Thermal Design Power (TDP) | 180 Watt | |
Peripherals |
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PCIe configurations | Gen 5, 96 Lanes, (CPU only) | |
PCI Express revision | 3.0 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |