AMD EPYC 8324P vs Intel Xeon E5-2651 v2

Comparative analysis of AMD EPYC 8324P and Intel Xeon E5-2651 v2 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD EPYC 8324P

  • CPU is newer: launch date 9 year(s) 10 month(s) later
  • 20 more cores, run more applications at once: 32 vs 12
  • 40 more threads: 64 vs 24
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 22 nm
  • 2.7x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 10.7x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 4.3x more L3 cache, more data can be stored in the L3 cache for quick access later
Launch date 18 Sep 2023 vs November 2013
Number of cores 32 vs 12
Number of threads 64 vs 24
Manufacturing process technology 5 nm vs 22 nm
L1 cache 64 KB (per core) vs 768 KB
L2 cache 1 MB (per core) vs 3 MB
L3 cache 128 MB (shared) vs 30 MB

Reasons to consider the Intel Xeon E5-2651 v2

Max number of CPUs in a configuration 2 vs 1

Compare benchmarks

CPU 1: AMD EPYC 8324P
CPU 2: Intel Xeon E5-2651 v2

Name AMD EPYC 8324P Intel Xeon E5-2651 v2
PassMark - Single thread mark 2367
PassMark - CPU mark 57127
Geekbench 4 - Single Core 2030
Geekbench 4 - Multi-Core 18071

Compare specifications (specs)

AMD EPYC 8324P Intel Xeon E5-2651 v2

Essentials

Launch date 18 Sep 2023 November 2013
Launch price (MSRP) $1895
Place in performance rating 366 328
Architecture codename Ivy Bridge-EP
Family Intel Xeon E5-2600 v2
Processor Number E5-2651 v2
Vertical segment Server

Performance

Base frequency 2.65 GHz 1800 MHz
Die size 4x 73 mm²
L1 cache 64 KB (per core) 768 KB
L2 cache 1 MB (per core) 3 MB
L3 cache 128 MB (shared) 30 MB
Manufacturing process technology 5 nm 22 nm
Maximum case temperature (TCase) 75°C
Maximum frequency 3 GHz
Number of cores 32 12
Number of threads 64 24
Transistor count 35,500 million
Unlocked
64 bit support
Bus Speed 5 GT/s DMI

Memory

ECC memory support
Supported memory types DDR5 DDR3
Max memory channels 4
Maximum memory size 768 GB (per socket)

Compatibility

Configurable TDP 155-225 Watt
Max number of CPUs in a configuration 1 2
Sockets supported SP6 LGA2011
Thermal Design Power (TDP) 180 Watt

Peripherals

PCIe configurations Gen 5, 96 Lanes, (CPU only)
PCI Express revision 3.0

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)