AMD GX-420CA vs Intel Core i3-330E
Comparative analysis of AMD GX-420CA and Intel Core i3-330E processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps), PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD GX-420CA
- 2 more cores, run more applications at once: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 28 nm vs 32 nm
- Around 40% lower typical power consumption: 25 Watt vs 35 Watt
Number of cores | 4 vs 2 |
Manufacturing process technology | 28 nm vs 32 nm |
Thermal Design Power (TDP) | 25 Watt vs 35 Watt |
Compare benchmarks
CPU 1: AMD GX-420CA
CPU 2: Intel Core i3-330E
Name | AMD GX-420CA | Intel Core i3-330E |
---|---|---|
GFXBench 4.0 - Car Chase Offscreen (Frames) | 496 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 496 | |
GFXBench 4.0 - Manhattan (Frames) | 868 | |
GFXBench 4.0 - Manhattan (Fps) | 868 | |
GFXBench 4.0 - T-Rex (Frames) | 773 | |
GFXBench 4.0 - T-Rex (Fps) | 773 | |
PassMark - Single thread mark | 934 | |
PassMark - CPU mark | 1260 |
Compare specifications (specs)
AMD GX-420CA | Intel Core i3-330E | |
---|---|---|
Essentials |
||
Architecture codename | eKabini | Arrandale |
Family | AMD G-Series | |
Launch date | 23 April 2013 | Q1'10 |
Place in performance rating | 2631 | 2353 |
Processor Number | GX-420CA | i3-330E |
Vertical segment | Embedded | Mobile |
Series | Legacy Intel® Core™ Processors | |
Status | Launched | |
Performance |
||
64 bit support | ||
Base frequency | 2000 MHz | 2.13 GHz |
L1 cache | 256 KB | |
L2 cache | 2 MB | |
Manufacturing process technology | 28 nm | 32 nm |
Maximum core temperature | 90 °C | 90°C for rPGA,105°C for BGA |
Number of cores | 4 | 2 |
Number of threads | 4 | 4 |
Bus Speed | 2.5 GT/s DMI | |
Die size | 81 mm2 | |
Transistor count | 382 million | |
Memory |
||
ECC memory support | ||
Max memory channels | 2 | 2 |
Supported memory types | DDR3-1600 | DDR3 800/1066 |
Maximum memory bandwidth | 17.1 GB/s | |
Maximum memory size | 8.79 GB | |
Graphics |
||
Graphics base frequency | 600 MHz | 500 MHz |
Processor graphics | Radeon HD 8400E | Intel HD Graphics |
Graphics max dynamic frequency | 667 MHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
||
Number of displays supported | 2 | 2 |
Graphics API support |
||
DirectX | 11.1 | |
OpenGL | 4.2 | |
Compatibility |
||
Sockets supported | BGA769 (FT3) | BGA1288 |
Thermal Design Power (TDP) | 25 Watt | 35 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | BGA 34mmX28mm | |
Peripherals |
||
PCI Express revision | 3.0 | 2.0 |
Max number of PCIe lanes | 16 | |
PCIe configurations | 1X16, 2X8 | |
Advanced Technologies |
||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Thermal Monitoring | ||
Virtualization |
||
AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) |