AMD Mobile Sempron 210U vs AMD Turion 64 MT-30

Comparative analysis of AMD Mobile Sempron 210U and AMD Turion 64 MT-30 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Mobile Sempron 210U

  • CPU is newer: launch date 3 year(s) 10 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
  • Around 67% lower typical power consumption: 15 Watt vs 25 Watt
  • Around 2% better performance in PassMark - Single thread mark: 299 vs 294
  • Around 9% better performance in PassMark - CPU mark: 267 vs 246
Specifications (specs)
Launch date 16 January 2009 vs March 2005
Manufacturing process technology 65 nm vs 90 nm
Thermal Design Power (TDP) 15 Watt vs 25 Watt
Benchmarks
PassMark - Single thread mark 299 vs 294
PassMark - CPU mark 267 vs 246

Reasons to consider the AMD Turion 64 MT-30

  • Around 7% higher clock speed: 1.6 GHz vs 1.5 GHz
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency 1.6 GHz vs 1.5 GHz
L2 cache 1024 KB vs 256 KB

Compare benchmarks

CPU 1: AMD Mobile Sempron 210U
CPU 2: AMD Turion 64 MT-30

PassMark - Single thread mark
CPU 1
CPU 2
299
294
PassMark - CPU mark
CPU 1
CPU 2
267
246
Name AMD Mobile Sempron 210U AMD Turion 64 MT-30
PassMark - Single thread mark 299 294
PassMark - CPU mark 267 246

Compare specifications (specs)

AMD Mobile Sempron 210U AMD Turion 64 MT-30

Essentials

Launch date 16 January 2009 March 2005
Place in performance rating 3239 3249
Series AMD Mobile Sempron Turion 64
Vertical segment Laptop Laptop
Architecture codename Lancaster

Performance

64 bit support
Front-side bus (FSB) 1600 MHz 800 MHz
L1 cache 128 KB 128 KB
L2 cache 256 KB 1024 KB
Manufacturing process technology 65 nm 90 nm
Maximum frequency 1.5 GHz 1.6 GHz
Number of cores 1 1
Number of threads 1 1
Die size 125 mm
Transistor count 114 million

Compatibility

Sockets supported 812-ball BGA 754
Thermal Design Power (TDP) 15 Watt 25 Watt
Max number of CPUs in a configuration 1

Advanced Technologies

PowerNow