AMD Mobile Sempron M100 vs AMD Mobile Sempron SI-42

Comparative analysis of AMD Mobile Sempron M100 and AMD Mobile Sempron SI-42 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD Mobile Sempron M100

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 40 nm vs 65 nm
  • Around 36% better performance in PassMark - CPU mark: 332 vs 245
  • Around 24% better performance in Geekbench 4 - Single Core: 1102 vs 887
  • Around 27% better performance in Geekbench 4 - Multi-Core: 1051 vs 829
Specifications (specs)
Manufacturing process technology 40 nm vs 65 nm
Benchmarks
PassMark - CPU mark 332 vs 245
Geekbench 4 - Single Core 1102 vs 887
Geekbench 4 - Multi-Core 1051 vs 829

Reasons to consider the AMD Mobile Sempron SI-42

  • Around 5% higher clock speed: 2.1 GHz vs 2 GHz
  • Around 17% better performance in PassMark - Single thread mark: 637 vs 546
Specifications (specs)
Maximum frequency 2.1 GHz vs 2 GHz
Benchmarks
PassMark - Single thread mark 637 vs 546

Compare benchmarks

CPU 1: AMD Mobile Sempron M100
CPU 2: AMD Mobile Sempron SI-42

PassMark - Single thread mark
CPU 1
CPU 2
546
637
PassMark - CPU mark
CPU 1
CPU 2
332
245
Geekbench 4 - Single Core
CPU 1
CPU 2
1102
887
Geekbench 4 - Multi-Core
CPU 1
CPU 2
1051
829
Name AMD Mobile Sempron M100 AMD Mobile Sempron SI-42
PassMark - Single thread mark 546 637
PassMark - CPU mark 332 245
Geekbench 4 - Single Core 1102 887
Geekbench 4 - Multi-Core 1051 829

Compare specifications (specs)

AMD Mobile Sempron M100 AMD Mobile Sempron SI-42

Essentials

Architecture codename Caspian Sable
Launch date 10 September 2009 1 September 2009
Place in performance rating 2527 2618
Series AMD Mobile Sempron AMD Mobile Sempron
Vertical segment Laptop Laptop

Performance

64 bit support
Front-side bus (FSB) 3200 MHz 1800 MHz
L1 cache 128 KB 128 KB
L2 cache 512 KB 512 KB
Manufacturing process technology 40 nm 65 nm
Maximum frequency 2 GHz 2.1 GHz
Number of cores 1 1
Number of threads 1 1
Maximum core temperature 100 °C

Compatibility

Sockets supported S S1g2
Thermal Design Power (TDP) 25 Watt 25 Watt

Advanced Technologies

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