Intel Core i3-2310E vs AMD Mobile Sempron M100
Comparative analysis of Intel Core i3-2310E and AMD Mobile Sempron M100 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-2310E
- CPU is newer: launch date 1 year(s) 4 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- 3 more threads: 4 vs 1
- Around 5% higher clock speed: 2.1 GHz vs 2 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 40 nm
- Around 34% better performance in PassMark - Single thread mark: 733 vs 546
- 5.6x better performance in PassMark - CPU mark: 1845 vs 332
| Specifications (specs) | |
| Launch date | February 2011 vs 10 September 2009 |
| Number of cores | 2 vs 1 |
| Number of threads | 4 vs 1 |
| Maximum frequency | 2.1 GHz vs 2 GHz |
| Manufacturing process technology | 32 nm vs 40 nm |
| Benchmarks | |
| PassMark - Single thread mark | 733 vs 546 |
| PassMark - CPU mark | 1845 vs 332 |
Reasons to consider the AMD Mobile Sempron M100
- Around 40% lower typical power consumption: 25 Watt vs 35 Watt
| Thermal Design Power (TDP) | 25 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Core i3-2310E
CPU 2: AMD Mobile Sempron M100
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i3-2310E | AMD Mobile Sempron M100 |
|---|---|---|
| PassMark - Single thread mark | 733 | 546 |
| PassMark - CPU mark | 1845 | 332 |
| Geekbench 4 - Single Core | 1102 | |
| Geekbench 4 - Multi-Core | 1051 |
Compare specifications (specs)
| Intel Core i3-2310E | AMD Mobile Sempron M100 | |
|---|---|---|
Essentials |
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| Architecture codename | Sandy Bridge | Caspian |
| Launch date | February 2011 | 10 September 2009 |
| Launch price (MSRP) | $225 | |
| Place in performance rating | 2613 | 2527 |
| Price now | $225 | |
| Processor Number | i3-2310E | |
| Series | Legacy Intel® Core™ Processors | AMD Mobile Sempron |
| Status | Launched | |
| Value for money (0-100) | 3.72 | |
| Vertical segment | Embedded | Laptop |
Performance |
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| 64 bit support | ||
| Base frequency | 2.10 GHz | |
| Die size | 149 mm | |
| L1 cache | 64 KB (per core) | 128 KB |
| L2 cache | 256 KB (per core) | 512 KB |
| L3 cache | 3072 KB (shared) | |
| Manufacturing process technology | 32 nm | 40 nm |
| Maximum core temperature | 100C (BGA) | |
| Maximum frequency | 2.1 GHz | 2 GHz |
| Number of cores | 2 | 1 |
| Number of threads | 4 | 1 |
| Transistor count | 624 million | |
| Front-side bus (FSB) | 3200 MHz | |
Memory |
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| ECC memory support | ||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 21.3 GB/s | |
| Maximum memory size | 16.6 GB | |
| Supported memory types | DDR3 1066/1333 | |
Graphics |
||
| Graphics base frequency | 650 MHz | |
| Graphics max dynamic frequency | 1.05 GHz | |
| Graphics max frequency | 1.05 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel® HD Graphics 3000 | |
Graphics interfaces |
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| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 2 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 31mm x 24mm (BGA1023) | |
| Sockets supported | FCBGA1023 | S |
| Thermal Design Power (TDP) | 35 Watt | 25 Watt |
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16, 2x8, 1x8+2x4 | |
Security & Reliability |
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| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| VirusProtect | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||