AMD Mobile Sempron SI-42 vs Intel Pentium Dual Core T2410
Comparative analysis of AMD Mobile Sempron SI-42 and Intel Pentium Dual Core T2410 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Mobile Sempron SI-42
- CPU is newer: launch date 1 year(s) 0 month(s) later
- Around 5% higher clock speed: 2.1 GHz vs 2 GHz
- Around 40% lower typical power consumption: 25 Watt vs 35 Watt
Launch date | 1 September 2009 vs 1 September 2008 |
Maximum frequency | 2.1 GHz vs 2 GHz |
Thermal Design Power (TDP) | 25 Watt vs 35 Watt |
Reasons to consider the Intel Pentium Dual Core T2410
- 1 more cores, run more applications at once: 2 vs 1
- 1 more threads: 2 vs 1
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 12% better performance in PassMark - Single thread mark: 712 vs 637
- 2.3x better performance in PassMark - CPU mark: 566 vs 245
Specifications (specs) | |
Number of cores | 2 vs 1 |
Number of threads | 2 vs 1 |
L2 cache | 1024 KB vs 512 KB |
Benchmarks | |
PassMark - Single thread mark | 712 vs 637 |
PassMark - CPU mark | 566 vs 245 |
Compare benchmarks
CPU 1: AMD Mobile Sempron SI-42
CPU 2: Intel Pentium Dual Core T2410
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Mobile Sempron SI-42 | Intel Pentium Dual Core T2410 |
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PassMark - Single thread mark | 637 | 712 |
PassMark - CPU mark | 245 | 566 |
Geekbench 4 - Single Core | 887 | |
Geekbench 4 - Multi-Core | 829 |
Compare specifications (specs)
AMD Mobile Sempron SI-42 | Intel Pentium Dual Core T2410 | |
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Essentials |
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Architecture codename | Sable | Merom |
Launch date | 1 September 2009 | 1 September 2008 |
Place in performance rating | 2624 | 2690 |
Series | AMD Mobile Sempron | Intel Pentium Dual Core |
Vertical segment | Laptop | Laptop |
Performance |
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64 bit support | ||
Front-side bus (FSB) | 1800 MHz | 533 MHz |
L1 cache | 128 KB | |
L2 cache | 512 KB | 1024 KB |
Manufacturing process technology | 65 nm | 65 nm |
Maximum core temperature | 100 °C | |
Maximum frequency | 2.1 GHz | 2 GHz |
Number of cores | 1 | 2 |
Number of threads | 1 | 2 |
Die size | 111 mm | |
Compatibility |
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Sockets supported | S1g2 | P, 478Pin |
Thermal Design Power (TDP) | 25 Watt | 35 Watt |