AMD Mobile Sempron SI-42 vs Intel Pentium Dual Core T2410

Comparative analysis of AMD Mobile Sempron SI-42 and Intel Pentium Dual Core T2410 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the AMD Mobile Sempron SI-42

  • CPU is newer: launch date 1 year(s) 0 month(s) later
  • Around 5% higher clock speed: 2.1 GHz vs 2 GHz
  • Around 40% lower typical power consumption: 25 Watt vs 35 Watt
Launch date 1 September 2009 vs 1 September 2008
Maximum frequency 2.1 GHz vs 2 GHz
Thermal Design Power (TDP) 25 Watt vs 35 Watt

Reasons to consider the Intel Pentium Dual Core T2410

  • 1 more cores, run more applications at once: 2 vs 1
  • 1 more threads: 2 vs 1
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 12% better performance in PassMark - Single thread mark: 712 vs 637
  • 2.3x better performance in PassMark - CPU mark: 566 vs 245
Specifications (specs)
Number of cores 2 vs 1
Number of threads 2 vs 1
L2 cache 1024 KB vs 512 KB
Benchmarks
PassMark - Single thread mark 712 vs 637
PassMark - CPU mark 566 vs 245

Compare benchmarks

CPU 1: AMD Mobile Sempron SI-42
CPU 2: Intel Pentium Dual Core T2410

PassMark - Single thread mark
CPU 1
CPU 2
637
712
PassMark - CPU mark
CPU 1
CPU 2
245
566
Name AMD Mobile Sempron SI-42 Intel Pentium Dual Core T2410
PassMark - Single thread mark 637 712
PassMark - CPU mark 245 566
Geekbench 4 - Single Core 887
Geekbench 4 - Multi-Core 829

Compare specifications (specs)

AMD Mobile Sempron SI-42 Intel Pentium Dual Core T2410

Essentials

Architecture codename Sable Merom
Launch date 1 September 2009 1 September 2008
Place in performance rating 2624 2690
Series AMD Mobile Sempron Intel Pentium Dual Core
Vertical segment Laptop Laptop

Performance

64 bit support
Front-side bus (FSB) 1800 MHz 533 MHz
L1 cache 128 KB
L2 cache 512 KB 1024 KB
Manufacturing process technology 65 nm 65 nm
Maximum core temperature 100 °C
Maximum frequency 2.1 GHz 2 GHz
Number of cores 1 2
Number of threads 1 2
Die size 111 mm

Compatibility

Sockets supported S1g2 P, 478Pin
Thermal Design Power (TDP) 25 Watt 35 Watt