Intel Core i3-3217UE vs AMD Mobile Sempron SI-42
Comparative analysis of Intel Core i3-3217UE and AMD Mobile Sempron SI-42 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core i3-3217UE
- CPU is newer: launch date 2 year(s) 11 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- 3 more threads: 4 vs 1
- Around 5% higher maximum core temperature: 105°C vs 100 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- Around 47% lower typical power consumption: 17 Watt vs 25 Watt
- Around 12% better performance in PassMark - Single thread mark: 711 vs 637
- 5.6x better performance in PassMark - CPU mark: 1362 vs 245
| Specifications (specs) | |
| Launch date | August 2012 vs 1 September 2009 |
| Number of cores | 2 vs 1 |
| Number of threads | 4 vs 1 |
| Maximum core temperature | 105°C vs 100 °C |
| Manufacturing process technology | 22 nm vs 65 nm |
| Thermal Design Power (TDP) | 17 Watt vs 25 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 711 vs 637 |
| PassMark - CPU mark | 1362 vs 245 |
Reasons to consider the AMD Mobile Sempron SI-42
- Around 31% higher clock speed: 2.1 GHz vs 1.6 GHz
| Maximum frequency | 2.1 GHz vs 1.6 GHz |
Compare benchmarks
CPU 1: Intel Core i3-3217UE
CPU 2: AMD Mobile Sempron SI-42
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i3-3217UE | AMD Mobile Sempron SI-42 |
|---|---|---|
| PassMark - Single thread mark | 711 | 637 |
| PassMark - CPU mark | 1362 | 245 |
| Geekbench 4 - Single Core | 887 | |
| Geekbench 4 - Multi-Core | 829 |
Compare specifications (specs)
| Intel Core i3-3217UE | AMD Mobile Sempron SI-42 | |
|---|---|---|
Essentials |
||
| Architecture codename | Ivy Bridge | Sable |
| Launch date | August 2012 | 1 September 2009 |
| Place in performance rating | 2664 | 2624 |
| Processor Number | i3-3217UE | |
| Series | Legacy Intel® Core™ Processors | AMD Mobile Sempron |
| Status | Launched | |
| Vertical segment | Embedded | Laptop |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.60 GHz | |
| Bus Speed | 5 GT/s DMI | |
| Die size | 118 mm | |
| L1 cache | 64 KB (per core) | 128 KB |
| L2 cache | 256 KB (per core) | 512 KB |
| L3 cache | 3072 KB (shared) | |
| Manufacturing process technology | 22 nm | 65 nm |
| Maximum core temperature | 105°C | 100 °C |
| Maximum frequency | 1.6 GHz | 2.1 GHz |
| Number of cores | 2 | 1 |
| Number of threads | 4 | 1 |
| Front-side bus (FSB) | 1800 MHz | |
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 25.6 GB/s | |
| Maximum memory size | 16 GB | |
| Supported memory types | DDR3/DDR3L 1333/1600 | |
Graphics |
||
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 900 MHz | |
| Graphics max frequency | 900 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Processor graphics | Intel® HD Graphics 4000 | |
Graphics interfaces |
||
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 31mm x 24mm | |
| Sockets supported | FCBGA1023 | S1g2 |
| Thermal Design Power (TDP) | 17 Watt | 25 Watt |
Peripherals |
||
| Max number of PCIe lanes | 1 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16 2x8 1x8 2x4 | |
Security & Reliability |
||
| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| 4G WiMAX Wireless | ||
| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® AVX | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® My WiFi technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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