AMD Opteron 2354 vs Intel Xeon X5690
Comparative analysis of AMD Opteron 2354 and Intel Xeon X5690 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the AMD Opteron 2354
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 33% more L2 cache; more data can be stored in the L2 cache for quick access later
- Around 13% lower typical power consumption: 115 Watt vs 130 Watt
L1 cache | 512 KB vs 64 KB (per core) |
L2 cache | 2 MB vs 256 KB (per core) |
Thermal Design Power (TDP) | 115 Watt vs 130 Watt |
Reasons to consider the Intel Xeon X5690
- CPU is newer: launch date 2 year(s) 9 month(s) later
- 2 more cores, run more applications at once: 6 vs 4
- 8 more threads: 12 vs 4
- Around 3% higher maximum core temperature: 78.5°C vs 76 °C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- 6x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2.3x more maximum memory size: 288 GB vs 128 GB
- Around 91% better performance in PassMark - Single thread mark: 1714 vs 899
- 4x better performance in PassMark - CPU mark: 12925 vs 3242
Specifications (specs) | |
Launch date | February 2011 vs 9 April 2008 |
Number of cores | 6 vs 4 |
Number of threads | 12 vs 4 |
Maximum core temperature | 78.5°C vs 76 °C |
Manufacturing process technology | 32 nm vs 65 nm |
L3 cache | 12288 KB (shared) vs 2 MB |
Maximum memory size | 288 GB vs 128 GB |
Benchmarks | |
PassMark - Single thread mark | 1714 vs 899 |
PassMark - CPU mark | 12925 vs 3242 |
Compare benchmarks
CPU 1: AMD Opteron 2354
CPU 2: Intel Xeon X5690
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Opteron 2354 | Intel Xeon X5690 |
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PassMark - Single thread mark | 899 | 1714 |
PassMark - CPU mark | 3242 | 12925 |
Geekbench 4 - Single Core | 637 | |
Geekbench 4 - Multi-Core | 3517 | |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 3.301 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 57.148 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.762 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 5.122 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 15.77 |
Compare specifications (specs)
AMD Opteron 2354 | Intel Xeon X5690 | |
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Essentials |
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Architecture codename | Barcelona | Westmere EP |
Family | Opteron | |
Launch date | 9 April 2008 | February 2011 |
Launch price (MSRP) | $455 | $205 |
Place in performance rating | 2316 | 2252 |
Processor Number | 2354 | X5690 |
Vertical segment | Server | Server |
Price now | $149 | |
Series | Legacy Intel® Xeon® Processors | |
Status | Discontinued | |
Value for money (0-100) | 17.68 | |
Performance |
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64 bit support | ||
Base frequency | 2200 MHz | 3.46 GHz |
L1 cache | 512 KB | 64 KB (per core) |
L2 cache | 2 MB | 256 KB (per core) |
L3 cache | 2 MB | 12288 KB (shared) |
Manufacturing process technology | 65 nm | 32 nm |
Maximum core temperature | 76 °C | 78.5°C |
Number of cores | 4 | 6 |
Number of threads | 4 | 12 |
Transistor count | 463 million | 1170 million |
Bus Speed | 6.4 GT/s QPI | |
Die size | 239 mm | |
Maximum frequency | 3.73 GHz | |
Number of QPI Links | 2 | |
VID voltage range | 0.750V-1.350V | |
Memory |
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Max memory channels | 2 | 3 |
Maximum memory size | 128 GB | 288 GB |
Supported memory types | DDR2 | DDR3 800/1066/1333 |
ECC memory support | ||
Maximum memory bandwidth | 32 GB/s | |
Compatibility |
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Max number of CPUs in a configuration | 2 | 2 |
Sockets supported | Fr2(1207) | FCLGA1366 |
Thermal Design Power (TDP) | 115 Watt | 130 Watt |
Low Halogen Options Available | ||
Package Size | 42.5mm X 45mm | |
Advanced Technologies |
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Enhanced Virus Protection (EVP) | ||
PowerNow | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 40-bit | |
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) |