AMD Opteron 3320 EE vs Intel Xeon E3-1230 v2
Comparative analysis of AMD Opteron 3320 EE and Intel Xeon E3-1230 v2 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Peripherals, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the AMD Opteron 3320 EE
- CPU is newer: launch date 12 year(s) 6 month(s) later
- Around 6% higher maximum core temperature: 70°C vs 65.8°C
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.8x lower typical power consumption: 25 Watt vs 69 Watt
Launch date | 2012 vs May 2012 |
Maximum core temperature | 70°C vs 65.8°C |
L2 cache | 4 MB vs 256 KB (per core) |
Thermal Design Power (TDP) | 25 Watt vs 69 Watt |
Reasons to consider the Intel Xeon E3-1230 v2
- 4 more threads: 8 vs 4
- Around 48% higher clock speed: 3.70 GHz vs 2.5 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
- 2.6x better performance in PassMark - Single thread mark: 1989 vs 774
- 2.3x better performance in PassMark - CPU mark: 6198 vs 2675
Specifications (specs) | |
Number of threads | 8 vs 4 |
Maximum frequency | 3.70 GHz vs 2.5 GHz |
Manufacturing process technology | 22 nm vs 32 nm |
L1 cache | 64 KB (per core) vs 192 KB |
Benchmarks | |
PassMark - Single thread mark | 1989 vs 774 |
PassMark - CPU mark | 6198 vs 2675 |
Compare benchmarks
CPU 1: AMD Opteron 3320 EE
CPU 2: Intel Xeon E3-1230 v2
PassMark - Single thread mark |
|
|
||||
PassMark - CPU mark |
|
|
Name | AMD Opteron 3320 EE | Intel Xeon E3-1230 v2 |
---|---|---|
PassMark - Single thread mark | 774 | 1989 |
PassMark - CPU mark | 2675 | 6198 |
Geekbench 4 - Single Core | 766 | |
Geekbench 4 - Multi-Core | 2984 | |
3DMark Fire Strike - Physics Score | 1873 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.493 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 78.109 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.544 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.162 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 5.824 |
Compare specifications (specs)
AMD Opteron 3320 EE | Intel Xeon E3-1230 v2 | |
---|---|---|
Essentials |
||
Architecture codename | Delhi | Ivy Bridge |
Family | AMD Opteron | |
Launch date | 2012 | May 2012 |
OPN Tray | OS3320SJW4KHK | |
Place in performance rating | 2515 | 2261 |
Series | AMD Opteron 3300 Series Processor | Intel® Xeon® Processor E3 v2 Family |
Vertical segment | Server | Server |
Launch price (MSRP) | $360 | |
Price now | $352.10 | |
Processor Number | E3-1230V2 | |
Status | Discontinued | |
Value for money (0-100) | 7.41 | |
Performance |
||
64 bit support | ||
Base frequency | 1.9 GHz | 3.30 GHz |
Die size | 315 mm | 160 mm |
L1 cache | 192 KB | 64 KB (per core) |
L2 cache | 4 MB | 256 KB (per core) |
L3 cache | 8 MB | 8192 KB (shared) |
Manufacturing process technology | 32 nm | 22 nm |
Maximum core temperature | 70°C | 65.8°C |
Maximum frequency | 2.5 GHz | 3.70 GHz |
Number of cores | 4 | 4 |
Number of threads | 4 | 8 |
Transistor count | 1200 million | 1400 million |
Unlocked | ||
Bus Speed | 5 GT/s DMI | |
Memory |
||
Supported memory frequency | 1400 MHz | |
Supported memory types | DDR3 | DDR3 1333/1600 |
ECC memory support | ||
Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32.77 GB | |
Compatibility |
||
Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | AM3+ | FCLGA1155 |
Thermal Design Power (TDP) | 25 Watt | 69 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Advanced Technologies |
||
Fused Multiply-Add (FMA) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
||
AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Peripherals |
||
PCI Express revision | 3.0 | |
PCIe configurations | 1x16 & 1x4, 2x8 & 1x4 or 1x8 & 3x4 | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) |