AMD Opteron 3320 EE vs Intel Xeon X5690
Comparative analysis of AMD Opteron 3320 EE and Intel Xeon X5690 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the AMD Opteron 3320 EE
- CPU is newer: launch date 13 year(s) 9 month(s) later
- 2.7x more L2 cache, more data can be stored in the L2 cache for quick access later
- 5.2x lower typical power consumption: 25 Watt vs 130 Watt
Launch date | 2012 vs February 2011 |
L2 cache | 4 MB vs 256 KB (per core) |
Thermal Design Power (TDP) | 25 Watt vs 130 Watt |
Reasons to consider the Intel Xeon X5690
- 2 more cores, run more applications at once: 6 vs 4
- 8 more threads: 12 vs 4
- Around 49% higher clock speed: 3.73 GHz vs 2.5 GHz
- Around 12% higher maximum core temperature: 78.5°C vs 70°C
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- 2.2x better performance in PassMark - Single thread mark: 1713 vs 774
- 4.8x better performance in PassMark - CPU mark: 12940 vs 2675
Specifications (specs) | |
Number of cores | 6 vs 4 |
Number of threads | 12 vs 4 |
Maximum frequency | 3.73 GHz vs 2.5 GHz |
Maximum core temperature | 78.5°C vs 70°C |
L1 cache | 64 KB (per core) vs 192 KB |
L3 cache | 12288 KB (shared) vs 8 MB |
Max number of CPUs in a configuration | 2 vs 1 |
Benchmarks | |
PassMark - Single thread mark | 1713 vs 774 |
PassMark - CPU mark | 12940 vs 2675 |
Compare benchmarks
CPU 1: AMD Opteron 3320 EE
CPU 2: Intel Xeon X5690
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD Opteron 3320 EE | Intel Xeon X5690 |
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PassMark - Single thread mark | 774 | 1713 |
PassMark - CPU mark | 2675 | 12940 |
Geekbench 4 - Single Core | 637 | |
Geekbench 4 - Multi-Core | 3517 | |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 3.301 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 57.148 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.762 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 5.122 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 15.77 |
Compare specifications (specs)
AMD Opteron 3320 EE | Intel Xeon X5690 | |
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Essentials |
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Architecture codename | Delhi | Westmere EP |
Family | AMD Opteron | |
Launch date | 2012 | February 2011 |
OPN Tray | OS3320SJW4KHK | |
Place in performance rating | 2515 | 2252 |
Series | AMD Opteron 3300 Series Processor | Legacy Intel® Xeon® Processors |
Vertical segment | Server | Server |
Launch price (MSRP) | $205 | |
Price now | $149 | |
Processor Number | X5690 | |
Status | Discontinued | |
Value for money (0-100) | 17.68 | |
Performance |
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64 bit support | ||
Base frequency | 1.9 GHz | 3.46 GHz |
Die size | 315 mm | 239 mm |
L1 cache | 192 KB | 64 KB (per core) |
L2 cache | 4 MB | 256 KB (per core) |
L3 cache | 8 MB | 12288 KB (shared) |
Manufacturing process technology | 32 nm | 32 nm |
Maximum core temperature | 70°C | 78.5°C |
Maximum frequency | 2.5 GHz | 3.73 GHz |
Number of cores | 4 | 6 |
Number of threads | 4 | 12 |
Transistor count | 1200 million | 1170 million |
Unlocked | ||
Bus Speed | 6.4 GT/s QPI | |
Number of QPI Links | 2 | |
VID voltage range | 0.750V-1.350V | |
Memory |
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Supported memory frequency | 1400 MHz | |
Supported memory types | DDR3 | DDR3 800/1066/1333 |
ECC memory support | ||
Max memory channels | 3 | |
Maximum memory bandwidth | 32 GB/s | |
Maximum memory size | 288 GB | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 2 |
Sockets supported | AM3+ | FCLGA1366 |
Thermal Design Power (TDP) | 25 Watt | 130 Watt |
Low Halogen Options Available | ||
Package Size | 42.5mm X 45mm | |
Advanced Technologies |
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Fused Multiply-Add (FMA) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.2 | |
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 40-bit | |
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) |