AMD Phenom II X2 N660 vs Intel Pentium Dual Core T2410

Comparative analysis of AMD Phenom II X2 N660 and Intel Pentium Dual Core T2410 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD Phenom II X2 N660

Intel Pentium Dual Core T2410

Differences

Reasons to consider the AMD Phenom II X2 N660

CPU is newer: launch date 2 year(s) 4 month(s) later
Around 50% higher clock speed: 3 GHz vs 2 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 54% better performance in PassMark - Single thread mark: 1093 vs 712
Around 91% better performance in PassMark - CPU mark: 1083 vs 566

Specifications (specs)
Launch date	1 January 2011 vs 1 September 2008
Maximum frequency	3 GHz vs 2 GHz
Manufacturing process technology	45 nm vs 65 nm
L2 cache	2 MB vs 1024 KB
Benchmarks
PassMark - Single thread mark	1093 vs 712
PassMark - CPU mark	1083 vs 566

Compare benchmarks

CPU 1: AMD Phenom II X2 N660
CPU 2: Intel Pentium Dual Core T2410

PassMark - Single thread mark

CPU 1

CPU 2

1093

712

PassMark - CPU mark

CPU 1

CPU 2

1083

566

Name	AMD Phenom II X2 N660	Intel Pentium Dual Core T2410
PassMark - Single thread mark	1093	712
PassMark - CPU mark	1083	566
Geekbench 4 - Single Core	264
Geekbench 4 - Multi-Core	444

Compare specifications (specs)

	AMD Phenom II X2 N660	Intel Pentium Dual Core T2410
Essentials
Architecture codename	Champlain	Merom
Family	AMD Phenom
Launch date	1 January 2011	1 September 2008
OPN Tray	HMN660DCR23GM
Place in performance rating	2701	2692
Series	AMD Phenom II Dual-Core Mobile Processors	Intel Pentium Dual Core
Vertical segment	Laptop	Laptop
Performance
64 bit support
Base frequency	3 GHz
Front-side bus (FSB)	3600 MHz	533 MHz
L1 cache	256 KB
L2 cache	2 MB	1024 KB
Manufacturing process technology	45 nm	65 nm
Maximum core temperature	100°C
Maximum frequency	3 GHz	2 GHz
Number of cores	2	2
Number of threads	2	2
Unlocked
Die size		111 mm
Memory
Supported memory types	DDR3
Compatibility
Sockets supported	S1	P, 478Pin
Thermal Design Power (TDP)	35 Watt	35 Watt
Advanced Technologies
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