Intel Celeron 827E vs AMD Phenom II X2 N660

Comparative analysis of Intel Celeron 827E and AMD Phenom II X2 N660 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron 827E

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
  • 2.1x lower typical power consumption: 17 Watt vs 35 Watt
Manufacturing process technology 32 nm vs 45 nm
Thermal Design Power (TDP) 17 Watt vs 35 Watt

Reasons to consider the AMD Phenom II X2 N660

  • 1 more cores, run more applications at once: 2 vs 1
  • 1 more threads: 2 vs 1
  • Around 62% better performance in PassMark - Single thread mark: 1093 vs 674
  • 2.9x better performance in PassMark - CPU mark: 1083 vs 371
Specifications (specs)
Number of cores 2 vs 1
Number of threads 2 vs 1
Benchmarks
PassMark - Single thread mark 1093 vs 674
PassMark - CPU mark 1083 vs 371

Compare benchmarks

CPU 1: Intel Celeron 827E
CPU 2: AMD Phenom II X2 N660

PassMark - Single thread mark
CPU 1
CPU 2
674
1093
PassMark - CPU mark
CPU 1
CPU 2
371
1083
Name Intel Celeron 827E AMD Phenom II X2 N660
PassMark - Single thread mark 674 1093
PassMark - CPU mark 371 1083
Geekbench 4 - Single Core 264
Geekbench 4 - Multi-Core 444

Compare specifications (specs)

Intel Celeron 827E AMD Phenom II X2 N660

Essentials

Architecture codename Sandy Bridge Champlain
Launch date Q3'11 1 January 2011
Place in performance rating 2746 2710
Processor Number 827E
Series Legacy Intel® Celeron® Processor AMD Phenom II Dual-Core Mobile Processors
Status Launched
Vertical segment Embedded Laptop
Family AMD Phenom
OPN Tray HMN660DCR23GM

Performance

64 bit support
Base frequency 1.40 GHz 3 GHz
Manufacturing process technology 32 nm 45 nm
Maximum core temperature 100 100°C
Number of cores 1 2
Number of threads 1 2
Front-side bus (FSB) 3600 MHz
L1 cache 256 KB
L2 cache 2 MB
Maximum frequency 3 GHz
Unlocked

Memory

Max memory channels 2
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 16.6 GB
Supported memory types DDR3 1066/1333 DDR3

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 800 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO

Compatibility

Low Halogen Options Available
Package Size 31mm x 24mm (FCBGA1023)
Sockets supported FCBGA1023 S1
Thermal Design Power (TDP) 17 Watt 35 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4

Security & Reliability

Anti-Theft technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
VirusProtect

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)