Intel Celeron 827E vs AMD Phenom II X2 N660

Comparative analysis of Intel Celeron 827E and AMD Phenom II X2 N660 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Celeron 827E

AMD Phenom II X2 N660

Differences

Reasons to consider the Intel Celeron 827E

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
2.1x lower typical power consumption: 17 Watt vs 35 Watt

Manufacturing process technology	32 nm vs 45 nm
Thermal Design Power (TDP)	17 Watt vs 35 Watt

Reasons to consider the AMD Phenom II X2 N660

1 more cores, run more applications at once: 2 vs 1
1 more threads: 2 vs 1
Around 62% better performance in PassMark - Single thread mark: 1093 vs 674
2.9x better performance in PassMark - CPU mark: 1083 vs 371

Specifications (specs)
Number of cores	2 vs 1
Number of threads	2 vs 1
Benchmarks
PassMark - Single thread mark	1093 vs 674
PassMark - CPU mark	1083 vs 371

Compare benchmarks

CPU 1: Intel Celeron 827E
CPU 2: AMD Phenom II X2 N660

PassMark - Single thread mark

CPU 1

CPU 2

674

1093

PassMark - CPU mark

CPU 1

CPU 2

371

1083

Name	Intel Celeron 827E	AMD Phenom II X2 N660
PassMark - Single thread mark	674	1093
PassMark - CPU mark	371	1083
Geekbench 4 - Single Core		264
Geekbench 4 - Multi-Core		444

Compare specifications (specs)

	Intel Celeron 827E	AMD Phenom II X2 N660
Essentials
Architecture codename	Sandy Bridge	Champlain
Launch date	Q3'11	1 January 2011
Place in performance rating	2746	2711
Processor Number	827E
Series	Legacy Intel® Celeron® Processor	AMD Phenom II Dual-Core Mobile Processors
Status	Launched
Vertical segment	Embedded	Laptop
Family		AMD Phenom
OPN Tray		HMN660DCR23GM
Performance
64 bit support
Base frequency	1.40 GHz	3 GHz
Manufacturing process technology	32 nm	45 nm
Maximum core temperature	100	100°C
Number of cores	1	2
Number of threads	1	2
Front-side bus (FSB)		3600 MHz
L1 cache		256 KB
L2 cache		2 MB
Maximum frequency		3 GHz
Unlocked
Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16.6 GB
Supported memory types	DDR3 1066/1333	DDR3
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	800 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Compatibility
Low Halogen Options Available
Package Size	31mm x 24mm (FCBGA1023)
Sockets supported	FCBGA1023	S1
Thermal Design Power (TDP)	17 Watt	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
VirusProtect
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)