AMD Ryzen 3 7335U vs Intel Xeon W-1270E

Comparative analysis of AMD Ryzen 3 7335U and Intel Xeon W-1270E processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the AMD Ryzen 3 7335U

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 14 nm
  • 2.9x lower typical power consumption: 28 Watt vs 80 Watt
Specifications (specs)
Manufacturing process technology 6 nm vs 14 nm
Thermal Design Power (TDP) 28 Watt vs 80 Watt
Benchmarks
PassMark - Single thread mark 3004 vs 2990

Reasons to consider the Intel Xeon W-1270E

  • 4 more cores, run more applications at once: 8 vs 4
  • 8 more threads: 16 vs 8
  • Around 12% higher clock speed: 4.80 GHz vs 4.3 GHz
  • Around 5% higher maximum core temperature: 100°C vs 95°C
  • 2x more L3 cache, more data can be stored in the L3 cache for quick access later
  • Around 50% better performance in PassMark - CPU mark: 18635 vs 12456
Specifications (specs)
Number of cores 8 vs 4
Number of threads 16 vs 8
Maximum frequency 4.80 GHz vs 4.3 GHz
Maximum core temperature 100°C vs 95°C
L3 cache 16 MB vs 8 MB (shared)
Benchmarks
PassMark - CPU mark 18635 vs 12456

Compare benchmarks

CPU 1: AMD Ryzen 3 7335U
CPU 2: Intel Xeon W-1270E

PassMark - Single thread mark
CPU 1
CPU 2
3004
2990
PassMark - CPU mark
CPU 1
CPU 2
12456
18635
Name AMD Ryzen 3 7335U Intel Xeon W-1270E
PassMark - Single thread mark 3004 2990
PassMark - CPU mark 12456 18635

Compare specifications (specs)

AMD Ryzen 3 7335U Intel Xeon W-1270E

Essentials

Launch date 4 Jan 2023 Q2'20
Place in performance rating 680 603
Architecture codename Comet Lake
Launch price (MSRP) $404
Processor Number W-1270E
Series Intel Xeon W Processor
Vertical segment Embedded

Performance

Base frequency 3 GHz 3.40 GHz
Die size 208 mm²
L1 cache 64 KB (per core)
L2 cache 512 KB (per core)
L3 cache 8 MB (shared) 16 MB
Manufacturing process technology 6 nm 14 nm
Maximum core temperature 95°C 100°C
Maximum frequency 4.3 GHz 4.80 GHz
Number of cores 4 8
Number of threads 8 16
Unlocked
64 bit support
Bus Speed 8 GT/s

Memory

ECC memory support
Supported memory types DDR5 DDR4-2933
Max memory channels 2
Maximum memory bandwidth 45.8 GB/s
Maximum memory size 128 GB

Compatibility

Max number of CPUs in a configuration 1 1
Sockets supported FP7 FCLGA1200
Thermal Design Power (TDP) 28 Watt 80 Watt
Package Size 37.5mm x 37.5mm
Thermal Solution PCG 2015W

Peripherals

PCIe configurations Gen 4, 20 Lanes, (CPU only) Up to 1x16, 2x8, 1x8+2x4
Max number of PCIe lanes 16
PCI Express revision 3.0
Scalability 1S Only

Graphics

Device ID 0x9BC6
Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.20 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 64 GB
Processor graphics Intel UHD Graphics 630

Graphics interfaces

DisplayPort
DVI
eDP
HDMI
Number of displays supported 3

Graphics image quality

4K resolution support
Max resolution over DisplayPort 4096x2304@60Hz
Max resolution over eDP 4096x2304@60Hz

Graphics API support

DirectX 12
OpenGL 4.5

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel SSE4.1, Intel SSE4.2, Intel AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)