AMD Ryzen 3 PRO 4200G vs Intel Core 2 Extreme QX9770

Comparative analysis of AMD Ryzen 3 PRO 4200G and Intel Core 2 Extreme QX9770 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

AMD Ryzen 3 PRO 4200G

Intel Core 2 Extreme QX9770

Differences

Reasons to consider the AMD Ryzen 3 PRO 4200G

Around 28% higher clock speed: 4.1 GHz vs 3.2 GHz
Around 71% higher maximum core temperature: 95° C vs 55.5°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 45 nm
2.1x lower typical power consumption: 65 Watt vs 136 Watt

Maximum frequency	4.1 GHz vs 3.2 GHz
Maximum core temperature	95° C vs 55.5°C
Manufacturing process technology	7 nm vs 45 nm
Thermal Design Power (TDP)	65 Watt vs 136 Watt

Reasons to consider the Intel Core 2 Extreme QX9770

Processor is unlocked, an unlocked multiplier allows for easier overclocking
6x more L2 cache, more data can be stored in the L2 cache for quick access later

Unlocked	Unlocked vs Locked
L2 cache	12288 KB vs 2 MB

Compare benchmarks

CPU 1: AMD Ryzen 3 PRO 4200G
CPU 2: Intel Core 2 Extreme QX9770

Name	AMD Ryzen 3 PRO 4200G	Intel Core 2 Extreme QX9770
PassMark - Single thread mark	2564
PassMark - CPU mark	11315
Geekbench 4 - Single Core		2338
Geekbench 4 - Multi-Core		6682

Compare specifications (specs)

	AMD Ryzen 3 PRO 4200G	Intel Core 2 Extreme QX9770
Essentials
Architecture codename	Zen 2	Yorkfield
Launch date	Q3'2020	March 2008
Place in performance rating	783	760
Vertical segment	Desktop	Desktop
Processor Number		QX9770
Series		Legacy Intel® Core™ Processors
Status		Discontinued
Performance
64 bit support
Base frequency	3.8 GHz	3.20 GHz
L1 cache	256 KB	256 KB
L2 cache	2 MB	12288 KB
L3 cache	4 MB
Manufacturing process technology	7 nm	45 nm
Maximum core temperature	95° C	55.5°C
Maximum frequency	4.1 GHz	3.2 GHz
Number of cores	4	4
Number of threads	8
Transistor count	9800 million	820 million
Unlocked
Bus Speed		1600 MHz FSB
Die size		214 mm2
Maximum case temperature (TCase)		55 °C
VID voltage range		0.8500V-1.3625V
Memory
Max memory channels	2
Supported memory types	DDR4-3200	DDR1, DDR2, DDR3
Graphics
Graphics base frequency	1700 MHz
Number of pipelines	384
Processor graphics	Radeon RX Vega 6 (Ryzen 4000)
Compatibility
Sockets supported	FP6	LGA775
Thermal Design Power (TDP)	65 Watt	136 Watt
Low Halogen Options Available
Max number of CPUs in a configuration		1
Package Size		37.5mm x 37.5mm
Peripherals
Max number of PCIe lanes	16
PCI Express revision	3.0
Advanced Technologies
Enhanced Virus Protection (EVP)
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)