AMD Ryzen 9 4900HS vs Intel Xeon W-3245
Comparative analysis of AMD Ryzen 9 4900HS and Intel Xeon W-3245 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics interfaces, Compatibility, Advanced Technologies, Virtualization, Peripherals, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the AMD Ryzen 9 4900HS
- CPU is newer: launch date 9 month(s) later
- Around 36% higher maximum core temperature: 105 °C vs 77°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- 5.9x lower typical power consumption: 35 Watt vs 205 Watt
| Specifications (specs) | |
| Launch date | 7 Mar 2020 vs 3 Jun 2019 |
| Maximum core temperature | 105 °C vs 77°C |
| Manufacturing process technology | 7 nm vs 14 nm |
| Thermal Design Power (TDP) | 35 Watt vs 205 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 2586 vs 2581 |
Reasons to consider the Intel Xeon W-3245
- 8 more cores, run more applications at once: 16 vs 8
- 16 more threads: 32 vs 16
- Around 2% higher clock speed: 4.40 GHz vs 4.3 GHz
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 83% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 64% better performance in PassMark - CPU mark: 30975 vs 18899
| Specifications (specs) | |
| Number of cores | 16 vs 8 |
| Number of threads | 32 vs 16 |
| Maximum frequency | 4.40 GHz vs 4.3 GHz |
| L2 cache | 16 MB vs 4 MB |
| L3 cache | 22 MB vs 12 MB |
| Benchmarks | |
| PassMark - CPU mark | 30975 vs 18899 |
Compare benchmarks
CPU 1: AMD Ryzen 9 4900HS
CPU 2: Intel Xeon W-3245
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD Ryzen 9 4900HS | Intel Xeon W-3245 |
|---|---|---|
| PassMark - Single thread mark | 2586 | 2581 |
| PassMark - CPU mark | 18899 | 30975 |
| 3DMark Fire Strike - Physics Score | 8230 | |
| Geekbench 4 - Single Core | 1118 | |
| Geekbench 4 - Multi-Core | 14290 |
Compare specifications (specs)
| AMD Ryzen 9 4900HS | Intel Xeon W-3245 | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 2 | Cascade Lake |
| Launch date | 7 Mar 2020 | 3 Jun 2019 |
| Place in performance rating | 760 | 749 |
| Vertical segment | Laptop | Workstation |
| Launch price (MSRP) | $1999 | |
| Processor Number | W-3245 | |
| Series | Intel Xeon W Processor | |
| Status | Launched | |
Performance |
||
| Base frequency | 3.0 GHz | 3.20 GHz |
| L1 cache | 1 MB | 1 MB |
| L2 cache | 4 MB | 16 MB |
| L3 cache | 12 MB | 22 MB |
| Manufacturing process technology | 7 nm | 14 nm |
| Maximum core temperature | 105 °C | 77°C |
| Maximum frequency | 4.3 GHz | 4.40 GHz |
| Number of cores | 8 | 16 |
| Number of GPU cores | 8 | |
| Number of threads | 16 | 32 |
| Unlocked | ||
| Number of Ultra Path Interconnect (UPI) Links | 0 | |
Memory |
||
| Supported memory types | DDR4-3200, LPDDR4-4266 | DDR4-2933 |
| ECC memory support | ||
| Max memory channels | 6 | |
| Maximum memory bandwidth | 131.13 GB/s | |
| Maximum memory size | 1 TB | |
| Supported memory frequency | 2933 MHz | |
Graphics interfaces |
||
| DisplayPort | ||
| HDMI | ||
Compatibility |
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| Max number of CPUs in a configuration | 1 | |
| Sockets supported | FP6 | FCLGA3647 |
| Thermal Design Power (TDP) | 35 Watt | 205 Watt |
| Package Size | 76.0mm x 56.5mm | |
Advanced Technologies |
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| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| Instruction set extensions | Intel AVX-512 | |
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® Volume Management Device (VMD) | ||
| Intel® vPro™ Platform Eligibility | ||
| Number of AVX-512 FMA Units | 2 | |
| Speed Shift technology | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Peripherals |
||
| Max number of PCIe lanes | 64 | |
| PCI Express revision | 3.0 | |
| Scalability | 1S Only | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Run Sure Technology | ||
| Intel® Trusted Execution technology (TXT) | ||
| Mode-based Execute Control (MBE) | ||
| Secure Boot | ||