AMD Ryzen 9 4900HS vs Intel Core i3-6100TE
Comparative analysis of AMD Ryzen 9 4900HS and Intel Core i3-6100TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics interfaces, Compatibility, Advanced Technologies, Virtualization, Graphics, Graphics image quality, Graphics API support, Peripherals, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the AMD Ryzen 9 4900HS
- 6 more cores, run more applications at once: 8 vs 2
- 12 more threads: 16 vs 4
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- Around 59% better performance in PassMark - Single thread mark: 2594 vs 1636
- 6x better performance in PassMark - CPU mark: 18937 vs 3152
| Specifications (specs) | |
| Number of cores | 8 vs 2 |
| Number of threads | 16 vs 4 |
| Manufacturing process technology | 7 nm vs 14 nm |
| Benchmarks | |
| PassMark - Single thread mark | 2594 vs 1636 |
| PassMark - CPU mark | 18937 vs 3152 |
Compare benchmarks
CPU 1: AMD Ryzen 9 4900HS
CPU 2: Intel Core i3-6100TE
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | AMD Ryzen 9 4900HS | Intel Core i3-6100TE |
|---|---|---|
| PassMark - Single thread mark | 2594 | 1636 |
| PassMark - CPU mark | 18937 | 3152 |
| 3DMark Fire Strike - Physics Score | 8230 | |
| GFXBench 4.0 - Car Chase Offscreen (Frames) | 1662 | |
| GFXBench 4.0 - Car Chase Offscreen (Fps) | 1662 | |
| GFXBench 4.0 - Manhattan (Frames) | 3412 | |
| GFXBench 4.0 - Manhattan (Fps) | 3412 | |
| GFXBench 4.0 - T-Rex (Frames) | 5721 | |
| GFXBench 4.0 - T-Rex (Fps) | 5721 |
Compare specifications (specs)
| AMD Ryzen 9 4900HS | Intel Core i3-6100TE | |
|---|---|---|
Essentials |
||
| Architecture codename | Zen 2 | Skylake |
| Launch date | 7 Mar 2020 | Q4'15 |
| Place in performance rating | 759 | 780 |
| Vertical segment | Laptop | Embedded |
| Processor Number | i3-6100TE | |
| Series | 6th Generation Intel® Core™ i3 Processors | |
| Status | Launched | |
Performance |
||
| Base frequency | 3.0 GHz | 2.70 GHz |
| L1 cache | 1 MB | |
| L2 cache | 4 MB | |
| L3 cache | 12 MB | |
| Manufacturing process technology | 7 nm | 14 nm |
| Maximum core temperature | 105 °C | |
| Maximum frequency | 4.3 GHz | |
| Number of cores | 8 | 2 |
| Number of GPU cores | 8 | |
| Number of threads | 16 | 4 |
| Unlocked | ||
| 64 bit support | ||
| Bus Speed | 8 GT/s DMI3 | |
Memory |
||
| Supported memory types | DDR4-3200, LPDDR4-4266 | DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V |
| Max memory channels | 2 | |
| Maximum memory bandwidth | 34.1 GB/s | |
| Maximum memory size | 64 GB | |
Graphics interfaces |
||
| DisplayPort | ||
| HDMI | ||
| DVI | ||
| eDP | ||
| Number of displays supported | 3 | |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | FP6 | FCLGA1151 |
| Thermal Design Power (TDP) | 35 Watt | 35 Watt |
| Low Halogen Options Available | ||
| Package Size | 37.5mm x 37.5mm | |
| Thermal Solution | PCG 2015A (35W) | |
Advanced Technologies |
||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
| Intel 64 | ||
| Intel® Hyper-Threading technology | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
||
| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
||
| Device ID | 0x1912 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.00 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
| Processor graphics | Intel® HD Graphics 530 | |
Graphics image quality |
||
| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2304@60Hz | |
| Max resolution over eDP | 4096x2304@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
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| DirectX | 12 | |
| OpenGL | 4.5 | |
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
| Scalability | 1S Only | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Navigation
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