AMD Ryzen 9 6900HS vs AMD Ryzen 5 7530U

Comparative analysis of AMD Ryzen 9 6900HS and AMD Ryzen 5 7530U processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.

AMD Ryzen 9 6900HS

AMD Ryzen 5 7530U

Differences

Reasons to consider the AMD Ryzen 9 6900HS

2 more cores, run more applications at once: 8 vs 6
4 more threads: 16 vs 12
Around 9% higher clock speed: 4.9 GHz vs 4.5 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 6 nm vs 7 nm
Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
Around 33% more L2 cache; more data can be stored in the L2 cache for quick access later
Around 6% better performance in PassMark - Single thread mark: 3286 vs 3108
Around 48% better performance in PassMark - CPU mark: 23566 vs 15932

Specifications (specs)
Number of cores	8 vs 6
Number of threads	16 vs 12
Maximum frequency	4.9 GHz vs 4.5 GHz
Manufacturing process technology	6 nm vs 7 nm
L1 cache	512 KB vs 384 KB
L2 cache	4 MB vs 3 MB
Benchmarks
PassMark - Single thread mark	3286 vs 3108
PassMark - CPU mark	23566 vs 15932

Reasons to consider the AMD Ryzen 5 7530U

CPU is newer: launch date 1 year(s) 0 month(s) later
2.3x lower typical power consumption: 15 Watt vs 35 Watt

Launch date	4 Jan 2023 vs Jan 2022
Thermal Design Power (TDP)	15 Watt vs 35 Watt

Compare benchmarks

CPU 1: AMD Ryzen 9 6900HS
CPU 2: AMD Ryzen 5 7530U

PassMark - Single thread mark

CPU 1

CPU 2

3286

3108

PassMark - CPU mark

CPU 1

CPU 2

23566

15932

Name	AMD Ryzen 9 6900HS	AMD Ryzen 5 7530U
PassMark - Single thread mark	3286	3108
PassMark - CPU mark	23566	15932
3DMark Fire Strike - Physics Score	6900

Compare specifications (specs)

	AMD Ryzen 9 6900HS	AMD Ryzen 5 7530U
Essentials
Architecture codename	Zen 3+	Zen 3
Launch date	Jan 2022	4 Jan 2023
Place in performance rating	608	583
Vertical segment	Mobile
OPN Tray		100-000000943
Performance
Base frequency	3.3 GHz	2.5 GHz
Die size	208 mm²	180 mm²
L1 cache	512 KB	384 KB
L2 cache	4 MB	3 MB
L3 cache	16 MB	16 MB
Manufacturing process technology	6 nm	7 nm
Maximum core temperature	95 °C	95 °C
Maximum frequency	4.9 GHz	4.5 GHz
Number of cores	8	6
Number of threads	16	12
Unlocked
Transistor count		10700 million
Memory
ECC memory support
Max memory channels	2	2
Supported memory types	DDR5-4800	DDR4-3200
Graphics
Graphics max frequency	2400 MHz	2000 MHz
Compatibility
Sockets supported	FP7	FP6
Thermal Design Power (TDP)	35 Watt	15 Watt
Max number of CPUs in a configuration		1
Peripherals
Max number of PCIe lanes	20	16
PCI Express revision	4.0	3.0
Advanced Technologies
AMD SenseMI
AMD StoreMI technology
Fused Multiply-Add 3 (FMA3)
Intel® Advanced Vector Extensions (AVX)
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Virtualization
AMD Virtualization (AMD-V™)